Brian M. ERWIN

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Formation of terminal metallurgy on laminates and boards
- Patent number 11,168,400
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit tester probe contact liner
- Patent number 11,009,545
- Issue date May 18, 2021
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier and integrated memory
- Patent number 10,892,249
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,840,214
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Finned contact
- Patent number 10,756,041
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit tester probe contact liner
- Patent number 10,670,653
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Element place on laminates
- Patent number 10,566,275
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,515,929
- Issue date Dec 24, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier and integrated memory
- Patent number 10,431,563
- Issue date Oct 1, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Element place on laminates
- Patent number 10,224,269
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a temporary test structure for device fabrication
- Patent number 10,043,723
- Issue date Aug 7, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a temporary test structure for device fabrication
- Patent number 9,997,424
- Issue date Jun 12, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security mesh and method of making
- Patent number 9,961,765
- Issue date May 1, 2018
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a temporary test structure for device fabrication
- Patent number 9,899,280
- Issue date Feb 20, 2018
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,754,823
- Issue date Sep 5, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate including selectively formed barrier layer
- Patent number 9,748,135
- Issue date Aug 29, 2017
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a temporary test structure for device fabrication
- Patent number 9,735,071
- Issue date Aug 15, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-transparent microelectronic grade glass as a substrate, tempora...
- Patent number 9,728,440
- Issue date Aug 8, 2017
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate warpage control
- Patent number 9,640,492
- Issue date May 2, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under die surface mounted electrical elements
- Patent number 9,601,423
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Security mesh and method of making
- Patent number 9,565,777
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Passivation layer topography
- Patent number 9,466,547
- Issue date Oct 11, 2016
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial solder bump support structure
- Patent number 9,431,359
- Issue date Aug 30, 2016
- International Business Machines Corporation
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer stack for contact formation
- Patent number 9,401,336
- Issue date Jul 26, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal solder joints for 3D packaging
- Patent number 9,343,420
- Issue date May 17, 2016
- GLOBALFOUNDRIES Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Use of electrolytic plating to control solder wetting
- Patent number 9,324,669
- Issue date Apr 26, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including passivation layer encapsulant
- Patent number 9,214,385
- Issue date Dec 15, 2015
- GLOBALFOUNDRIES Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic coating to inhibit solder wetting on pillar sidewalls
- Patent number 9,190,376
- Issue date Nov 17, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) with variable offset bumps
- Patent number 8,710,656
- Issue date Apr 29, 2014
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material, test structure and method of use
- Patent number 8,686,749
- Issue date Apr 1, 2014
- International Business Machines Corporation
- Brian M. Erwin
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
FINNED CONTACT
- Publication number 20200294946
- Publication date Sep 17, 2020
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER
- Publication number 20200209308
- Publication date Jul 2, 2020
- International Business Machines Corporation
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FORMATION OF TERMINAL METALLURGY ON LAMINATES AND BOARDS
- Publication number 20190390348
- Publication date Dec 26, 2019
- International Business Machines Corporation
- Charles L. Arvin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190378816
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER
- Publication number 20190353702
- Publication date Nov 21, 2019
- Charles L. Arvin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312009
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312011
- Publication date Oct 10, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER AND INTEGRATED MEMORY
- Publication number 20190312010
- Publication date Oct 10, 2019
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT PLACE ON LAMINATES
- Publication number 20190148283
- Publication date May 16, 2019
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION
- Publication number 20180090400
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Charles L. Arvin
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION
- Publication number 20180090399
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Charles L. Arvin
- G01 - MEASURING TESTING
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180082965
- Publication date Mar 22, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20180076160
- Publication date Mar 15, 2018
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION
- Publication number 20170263514
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTION OF ELEMENTS ON A LAMINATE SURFACE
- Publication number 20170179042
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELEMENT PLACE ON LAMINATES
- Publication number 20170179015
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY MESH AND METHOD OF MAKING
- Publication number 20170171964
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...
- Publication number 20170117241
- Publication date Apr 27, 2017
- SUSS MicroTec Photonic Systems Inc.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION
- Publication number 20170062291
- Publication date Mar 2, 2017
- International Business Machines Corporation
- Charles L. Arvin
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20160204028
- Publication date Jul 14, 2016
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...
- Publication number 20160184926
- Publication date Jun 30, 2016
- SUSS MicroTec Photonic Systems Inc.
- Courtney T. Sheets
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL LAYER STACK FOR CONTACT FORMATION
- Publication number 20160126201
- Publication date May 5, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-TRANSPARENT MICROELECTRONIC GRADE GLASS AS A SUBSTRATE, TEMPORA...
- Publication number 20160118287
- Publication date Apr 28, 2016
- International Business Machines Corporation
- Charles L. Arvin
- B32 - LAYERED PRODUCTS
Information Patent Application
USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING
- Publication number 20160079193
- Publication date Mar 17, 2016
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ETCHING SYSTEM INCLUDING MASK RETICLE FOR MULTI-DEPTH ETCHING
- Publication number 20160074968
- Publication date Mar 17, 2016
- SUSS MicroTec Photonic Systems Inc.
- Matthew E. Souter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT
- Publication number 20160035641
- Publication date Feb 4, 2016
- GLOBALFOUNDRIES INC.
- Brian M. Erwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20150357235
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER
- Publication number 20150348831
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Yuri M. Brovman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLATING WITHOUT PHOTORESIST
- Publication number 20150348910
- Publication date Dec 3, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC COATING TO INHIBIT SOLDER WETTING ON PILLAR SIDEWALLS
- Publication number 20150333025
- Publication date Nov 19, 2015
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS

Brian M. ERWIN

Person

Patents Grantslast 30 patents

Formation of terminal metallurgy on laminates and boards

Integrated circuit tester probe contact liner

Carrier and integrated memory

Carrier and integrated memory

Finned contact

Integrated circuit tester probe contact liner

Element place on laminates

Carrier and integrated memory

Carrier and integrated memory

Element place on laminates

Method of forming a temporary test structure for device fabrication

Method of forming a temporary test structure for device fabrication

Security mesh and method of making

Method of forming a temporary test structure for device fabrication

Substrate including selectively formed barrier layer

Substrate including selectively formed barrier layer

Method of forming a temporary test structure for device fabrication

Non-transparent microelectronic grade glass as a substrate, tempora...

Laminate warpage control

Under die surface mounted electrical elements

Security mesh and method of making

Passivation layer topography

Coaxial solder bump support structure

Dual layer stack for contact formation

Universal solder joints for 3D packaging

Use of electrolytic plating to control solder wetting

Semiconductor device including passivation layer encapsulant

Organic coating to inhibit solder wetting on pillar sidewalls

Redistribution layer (RDL) with variable offset bumps

Thermal interface material, test structure and method of use

Patents Applicationslast 30 patents

FINNED CONTACT

INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER

FORMATION OF TERMINAL METALLURGY ON LAMINATES AND BOARDS

CARRIER AND INTEGRATED MEMORY

INTEGRATED CIRCUIT TESTER PROBE CONTACT LINER

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

CARRIER AND INTEGRATED MEMORY

ELEMENT PLACE ON LAMINATES

METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION

METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION

PROTECTION OF ELEMENTS ON A LAMINATE SURFACE

ELEMENT PLACE ON LAMINATES

SECURITY MESH AND METHOD OF MAKING

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCO...

METHOD OF FORMING A TEMPORARY TEST STRUCTURE FOR DEVICE FABRICATION

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

LASER ABLATION SYSTEM INCLUDING VARIABLE ENERGY BEAM TO MINIMIZE ET...

DUAL LAYER STACK FOR CONTACT FORMATION

NON-TRANSPARENT MICROELECTRONIC GRADE GLASS AS A SUBSTRATE, TEMPORA...

USE OF ELECTROLYTIC PLATING TO CONTROL SOLDER WETTING

LASER ETCHING SYSTEM INCLUDING MASK RETICLE FOR MULTI-DEPTH ETCHING

SEMICONDUCTOR DEVICE INCLUDING PASSIVATION LAYER ENCAPSULANT

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

SUBSTRATE INCLUDING SELECTIVELY FORMED BARRIER LAYER

SELECTIVE PLATING WITHOUT PHOTORESIST

ORGANIC COATING TO INHIBIT SOLDER WETTING ON PILLAR SIDEWALLS