Brian P. Balut

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Mount Dora, FL, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with lid having lid conductive structure
- Patent number 9,799,637
- Issue date Oct 24, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDING COMPOUND THERMAL ENHANCEMENT UTILIZING GRAPHENE OR GRAPHITE...
- Publication number 20230343662
- Publication date Oct 26, 2023
- Qorvo US, Inc.
- Christo Bojkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LID HAVING LID CONDUCTIVE STRUCTURE
- Publication number 20170236808
- Publication date Aug 17, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS