Brian Patrick Hoden

Person

Huntsville, AL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cooling module for providing enhanced localized cooling of a heatsink
- Patent number 12,356,585
- Issue date Jul 8, 2025
- Abaco Systems, Inc.
- Joo Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit card assemblies
- Patent number 12,328,847
- Issue date Jun 10, 2025
- Ametek, Inc.
- Joo-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conduction cooled chassis
- Patent number 12,213,285
- Issue date Jan 28, 2025
- Ametek, Inc.
- Peter Kortekaas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics chassis with oscillating heat pipe (OHP)
- Patent number 11,112,840
- Issue date Sep 7, 2021
- Abaco Systems, Inc.
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Circuit card assembly including heat transfer assembly and method o...
- Patent number 9,750,127
- Issue date Aug 29, 2017
- General Electric Company
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card assembly and method of manufacturing thereof
- Patent number 9,370,090
- Issue date Jun 14, 2016
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics chassis and method of fabricating the same
- Patent number 9,333,599
- Issue date May 10, 2016
- General Electric Company
- Hendrik Pieter Jacobus de Bock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IMPINGEMENT COOLING PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
- Publication number 20240107714
- Publication date Mar 28, 2024
- Abaco Systems, Inc.
- Lucius AKALANNE
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
- Publication number 20240032255
- Publication date Jan 25, 2024
- Abaco Systems, Inc.
- Joo Han KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARD ASSEMBLIES
- Publication number 20230134978
- Publication date May 4, 2023
- AMETEK, INC.
- Joo-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE DEPENDENT ELECTRONIC COMPONENT HEATING SYSTEM
- Publication number 20230062660
- Publication date Mar 2, 2023
- AMETEK, INC.
- Brian Hoden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTION COOLED CHASSIS
- Publication number 20230025346
- Publication date Jan 26, 2023
- AMETEK, INC.
- Peter Kortekaas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS CHASSIS WITH OSCILLATING HEAT PIPE (OHP)
- Publication number 20210055770
- Publication date Feb 25, 2021
- Abaco Systems, Inc.
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT CARD ASSEMBLY INCLUDING HEAT TRANSFER ASSEMBLY AND METHOD O...
- Publication number 20170164459
- Publication date Jun 8, 2017
- GENERAL ELECTRIC COMPANY
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEZZANINE FILLER MODULE APPARATUSES AND METHODS FOR COMPUTING DEVICES
- Publication number 20170147044
- Publication date May 25, 2017
- GENERAL ELECTRIC COMPANY
- David S. Slaton
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEATSPREADER WITH EXTENDED SURFACE FOR HEAT TRANSFER THROUGH A SEAL...
- Publication number 20160169594
- Publication date Jun 16, 2016
- GE INTELLIGENT PLATFORMS, INC.
- Hendrik Pieter Jacobus DE BOCK
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF
- Publication number 20160095199
- Publication date Mar 31, 2016
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE ASSEMBLY
- Publication number 20160021788
- Publication date Jan 21, 2016
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS CHASSIS AND METHOD OF FABRICATING THE SAME
- Publication number 20150181763
- Publication date Jun 25, 2015
- GENERAL ELECTRIC COMPANY
- Hendrik Pieter Jacobus de Bock
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Brian Patrick Hoden

Person

Patents Grantslast 30 patents

Cooling module for providing enhanced localized cooling of a heatsink

Circuit card assemblies

Conduction cooled chassis

Electronics chassis with oscillating heat pipe (OHP)

Circuit card assembly including heat transfer assembly and method o...

Circuit card assembly and method of manufacturing thereof

Electronics chassis and method of fabricating the same

Patents Applicationslast 30 patents

IMPINGEMENT COOLING PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK

COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK

CIRCUIT CARD ASSEMBLIES

TEMPERATURE DEPENDENT ELECTRONIC COMPONENT HEATING SYSTEM

CONDUCTION COOLED CHASSIS

ELECTRONICS CHASSIS WITH OSCILLATING HEAT PIPE (OHP)

CIRCUIT CARD ASSEMBLY INCLUDING HEAT TRANSFER ASSEMBLY AND METHOD O...

MEZZANINE FILLER MODULE APPARATUSES AND METHODS FOR COMPUTING DEVICES

HEATSPREADER WITH EXTENDED SURFACE FOR HEAT TRANSFER THROUGH A SEAL...

CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF

ELECTRONIC DEVICE ASSEMBLY

ELECTRONICS CHASSIS AND METHOD OF FABRICATING THE SAME