Brian R. Hutchison

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Windsor, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Bond-free interconnect between a microcircuit housing and a printed...
- Patent number 10,750,617
- Issue date Aug 18, 2020
- Keysight Technologies, Inc.
- Michael John Harriman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integral dielectric heatspreader
- Patent number 6,414,847
- Issue date Jul 2, 2002
- Agilent Technologies, Inc.
- Brian R. Hutchison
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency electronic package with arbitrarily-shaped interconn...
- Patent number 6,137,693
- Issue date Oct 24, 2000
- Agilent Technologies Inc.
- Matthew K. Schwiebert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-frame based vertical interconnect package
- Patent number 6,061,251
- Issue date May 9, 2000
- Hewlett-Packard Company
- Brian R. Hutchison
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND-FREE INTERCONNECT BETWEEN A MICROCIRCUIT HOUSING AND A PRINTED...
- Publication number 20200214139
- Publication date Jul 2, 2020
- KEYSIGHT TECHNOLOGIES, INC.
- Michael John Harriman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDED HIGH-FREQUENCY CIRCUIT MODULE
- Publication number 20090059540
- Publication date Mar 5, 2009
- Kirk S. Giboney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR