Brian S. Beaman

Person

Apex, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
In-flight servicing of an aerial vehicle
- Patent number 11,915,168
- Issue date Feb 27, 2024
- International Business Machines Corporation
- Sarbajit K. Rakshit
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Off the module cable assembly
- Patent number 10,903,593
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Brian Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Efficient placement of grid array components
- Patent number 10,756,009
- Issue date Aug 25, 2020
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In flight transfer of packages between aerial drones
- Patent number 10,661,899
- Issue date May 26, 2020
- International Business Machines Corporation
- Brian S. Beaman
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
LGA socket with improved high-speed differential signal performance
- Patent number 10,566,712
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Brian Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing in-flight transfer of parcels using blockchain authentication
- Patent number 10,547,454
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Brian S. Beaman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
LGA socket with improved high-speed differential signal performance
- Patent number 10,516,223
- Issue date Dec 24, 2019
- International Business Machines Corporation
- Brian Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a hybrid land grid array connector
- Patent number 10,135,162
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector having a body with a conductive layer common to top and b...
- Patent number 10,128,593
- Issue date Nov 13, 2018
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In flight transfer of packages between aerial drones
- Patent number 9,889,933
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Brian S. Beaman
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Printed circuit board edge connector
- Patent number 9,814,140
- Issue date Nov 7, 2017
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board edge connector
- Patent number 9,693,457
- Issue date Jun 27, 2017
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing corrosion of an electrical connector
- Patent number 9,640,888
- Issue date May 2, 2017
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Brian S. Beaman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
In flight transfer of packages between aerial drones
- Patent number 9,561,852
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Brian S. Beaman
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Grant
Printed circuit board edge connector
- Patent number 9,549,469
- Issue date Jan 17, 2017
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromechanical assembly with socket and card edge connector
- Patent number 9,484,649
- Issue date Nov 1, 2016
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial probe structure of elongated electrical conductors projecti...
- Patent number 9,404,942
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Inc.
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Short path circuit card
- Patent number 9,252,521
- Issue date Feb 2, 2016
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a land grid array (LGA) interposer utilizing me...
- Patent number 8,752,284
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Probe structure having a plurality of discrete insulated probe tips...
- Patent number 8,754,666
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Printed circuit board edge connector
- Patent number 8,677,617
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Land grid array interposer producing method
- Patent number 8,505,200
- Issue date Aug 13, 2013
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redox method of forming a coaxial probe structure of elongated elec...
- Patent number 8,491,772
- Issue date Jul 23, 2013
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Electrodeposition method of forming a probe structure having a plur...
- Patent number 8,486,250
- Issue date Jul 16, 2013
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Grant
Method of producing a land grid array interposer
- Patent number 8,479,388
- Issue date Jul 9, 2013
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a land grid array (LGA) interposer structure
- Patent number 8,341,834
- Issue date Jan 1, 2013
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a land grid array (LGA) interposer structure
- Patent number 8,316,540
- Issue date Nov 27, 2012
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment structure having a frame structure and bridging connectio...
- Patent number 8,267,701
- Issue date Sep 18, 2012
- International Business Machines Corporation
- Brian S. Beaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a land grid array (LGA) interposer
- Patent number 8,191,245
- Issue date Jun 5, 2012
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a land grid array interposer
- Patent number 8,171,630
- Issue date May 8, 2012
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Standoff And Support Structures for Reliable Land Grid Array and Hy...
- Publication number 20240008208
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Mark K. Hoffmeyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-FLIGHT SERVICING OF AN AERIAL VEHICLE
- Publication number 20220129826
- Publication date Apr 28, 2022
- International Business Machines Corporation
- SARBAJIT K. RAKSHIT
- B60 - VEHICLES IN GENERAL
Information Patent Application
OFF THE MODULE CABLE ASSEMBLY
- Publication number 20200366015
- Publication date Nov 19, 2020
- International Business Machines Corporation
- Brian Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANAGING IN-FLIGHT TRANSFER OF PARCELS USING BLOCKCHAIN AUTHENTICATION
- Publication number 20190199534
- Publication date Jun 27, 2019
- International Business Machines Corporation
- Brian S. Beaman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LGA SOCKET WITH IMPROVED HIGH-SPEED DIFFERENTIAL SIGNAL PERFORMANCE
- Publication number 20180351277
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Brian Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LGA SOCKET WITH IMPROVED HIGH-SPEED DIFFERENTIAL SIGNAL PERFORMANCE
- Publication number 20180351276
- Publication date Dec 6, 2018
- International Business Machines Corporation
- Brian Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRACKING EYE MOVEMENTS WITH A SMART DEVICE
- Publication number 20180239422
- Publication date Aug 23, 2018
- International Business Machines Corporation
- Brian S. Beaman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
IN FLIGHT TRANSFER OF PACKAGES BETWEEN AERIAL DRONES
- Publication number 20180086460
- Publication date Mar 29, 2018
- International Business Machines Corporation
- Brian S. Beaman
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
IN FLIGHT TRANSFER OF PACKAGES BETWEEN AERIAL DRONES
- Publication number 20170190422
- Publication date Jul 6, 2017
- International Business Machines Corporation
- Brian S. Beaman
- B64 - AIRCRAFT AVIATION COSMONAUTICS
Information Patent Application
Printed Circuit Board Edge Connector
- Publication number 20160249454
- Publication date Aug 25, 2016
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMECHANICAL ASSEMBLY WITH SOCKET AND CARD EDGE CONNECTOR
- Publication number 20160226166
- Publication date Aug 4, 2016
- Lenovo Enterprise Solutions (Singapore) Pte. Ltd.
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preventing Corrosion of an Electrical Connector
- Publication number 20160160360
- Publication date Jun 9, 2016
- Brian S. Beaman
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SHORT PATH CIRCUIT CARD
- Publication number 20160036153
- Publication date Feb 4, 2016
- LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD.
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...
- Publication number 20140191775
- Publication date Jul 10, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
Printed Circuit Board Edge Connector
- Publication number 20140158403
- Publication date Jun 12, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Printed Circuit Board Edge Connector
- Publication number 20140158404
- Publication date Jun 12, 2014
- International Business Machines Corporation
- Brian Samuel Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Meeting Calendar Optimization
- Publication number 20110320237
- Publication date Dec 29, 2011
- International Business Machines Corporation
- Brian S. Beaman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LARGE SCALE HYBRID SOCKET FOR AN AREA ARRAY DEVICE
- Publication number 20110287638
- Publication date Nov 24, 2011
- International Business Machines Corporation
- Brian S. Beaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed Circuit Board Edge Connector
- Publication number 20110266042
- Publication date Nov 3, 2011
- International Business Machines Corporation
- Brian S. Beaman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
A PRINTED CIRCUIT BOARD WITH HOLES WITH CONDUCTORS COMPRESSING COMP...
- Publication number 20110151688
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD WITH HOLES WITH CONDUCTORS COMPRESSING A COMP...
- Publication number 20110151681
- Publication date Jun 23, 2011
- International Business Machines Corporation
- Brian S. Beaman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-...
- Publication number 20100279521
- Publication date Nov 4, 2010
- International Business Machines Corporation
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Topography compensating land grid array interposer
- Publication number 20100173505
- Publication date Jul 8, 2010
- Gareth G. Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100052715
- Publication date Mar 4, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045317
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045320
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045321
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045318
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045266
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING
Information Patent Application
HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...
- Publication number 20100045324
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Brian Samuel Beaman
- G01 - MEASURING TESTING

Brian S. Beaman

Person

Patents Grantslast 30 patents

In-flight servicing of an aerial vehicle

Off the module cable assembly

Efficient placement of grid array components

In flight transfer of packages between aerial drones

LGA socket with improved high-speed differential signal performance

Managing in-flight transfer of parcels using blockchain authentication

LGA socket with improved high-speed differential signal performance

Method for fabricating a hybrid land grid array connector

Connector having a body with a conductive layer common to top and b...

In flight transfer of packages between aerial drones

Printed circuit board edge connector

Printed circuit board edge connector

Preventing corrosion of an electrical connector

In flight transfer of packages between aerial drones

Printed circuit board edge connector

Electromechanical assembly with socket and card edge connector

Coaxial probe structure of elongated electrical conductors projecti...

Short path circuit card

Method of producing a land grid array (LGA) interposer utilizing me...

Probe structure having a plurality of discrete insulated probe tips...

Printed circuit board edge connector

Land grid array interposer producing method

Redox method of forming a coaxial probe structure of elongated elec...

Electrodeposition method of forming a probe structure having a plur...

Method of producing a land grid array interposer

Method of producing a land grid array (LGA) interposer structure

Method of producing a land grid array (LGA) interposer structure

Alignment structure having a frame structure and bridging connectio...

Method of forming a land grid array (LGA) interposer

Method of producing a land grid array interposer

Patents Applicationslast 30 patents

Standoff And Support Structures for Reliable Land Grid Array and Hy...

IN-FLIGHT SERVICING OF AN AERIAL VEHICLE

OFF THE MODULE CABLE ASSEMBLY

MANAGING IN-FLIGHT TRANSFER OF PARCELS USING BLOCKCHAIN AUTHENTICATION

LGA SOCKET WITH IMPROVED HIGH-SPEED DIFFERENTIAL SIGNAL PERFORMANCE

LGA SOCKET WITH IMPROVED HIGH-SPEED DIFFERENTIAL SIGNAL PERFORMANCE

TRACKING EYE MOVEMENTS WITH A SMART DEVICE

IN FLIGHT TRANSFER OF PACKAGES BETWEEN AERIAL DRONES

IN FLIGHT TRANSFER OF PACKAGES BETWEEN AERIAL DRONES

Printed Circuit Board Edge Connector

ELECTROMECHANICAL ASSEMBLY WITH SOCKET AND CARD EDGE CONNECTOR

Preventing Corrosion of an Electrical Connector

SHORT PATH CIRCUIT CARD

REDOX METHOD OF FORMING A COAXIAL PROBE STRUCTURE OF ELONGATED ELEC...

Printed Circuit Board Edge Connector

Printed Circuit Board Edge Connector

Meeting Calendar Optimization

LARGE SCALE HYBRID SOCKET FOR AN AREA ARRAY DEVICE

Printed Circuit Board Edge Connector

A PRINTED CIRCUIT BOARD WITH HOLES WITH CONDUCTORS COMPRESSING COMP...

PRINTED CIRCUIT BOARD WITH HOLES WITH CONDUCTORS COMPRESSING A COMP...

LAND GRID ARRAY (LGA) INTERPOSER UTILIZING METAL-ON-ELASTOMER HEMI-...

Topography compensating land grid array interposer

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...

HIGH DENSITY INTEGRATED CIRCUIT APPARATUS, TEST PROBE AND METHODS O...