Brian Taggart

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit device mounting with folded substrate and interp...
- Patent number 7,818,878
- Issue date Oct 26, 2010
- Intel Corporation
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for trace shielding and routing on a substrate
- Patent number 7,375,978
- Issue date May 20, 2008
- Intel Corporation
- John Conner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package having a stiffening element and method of m...
- Patent number 7,372,133
- Issue date May 13, 2008
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Folded substrate with interposer package for integrated circuit dev...
- Patent number 7,358,444
- Issue date Apr 15, 2008
- Intel Corporation
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power distribution within a folded flex package method and apparatus
- Patent number 7,304,373
- Issue date Dec 4, 2007
- Intel Corporation
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond finger on via substrate, process of making same, package made...
- Patent number 7,302,756
- Issue date Dec 4, 2007
- Intel Corporation
- Brian Taggart
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circular wire-bond pad, package made therewith, and method of assem...
- Patent number 7,250,684
- Issue date Jul 31, 2007
- Intel Corporation
- Robert Nickerson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bottom heat spreader
- Patent number 7,190,068
- Issue date Mar 13, 2007
- Intel Corporation
- Dale Hackitt
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FOLDED SUBSTRATE WITH INTERPOSER PACKAGE FOR INTEGRATED CIRCUIT DEV...
- Publication number 20080148559
- Publication date Jun 26, 2008
- Robert M. NICKERSON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE...
- Publication number 20080023820
- Publication date Jan 31, 2008
- Intel Corporation
- Brian Taggart
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEM...
- Publication number 20080014436
- Publication date Jan 17, 2008
- Intel Corporation
- Robert Nickerson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microelectronic package having a stiffening element and method of m...
- Publication number 20070126094
- Publication date Jun 7, 2007
- Intel Corporation
- Saeed Shojaie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging logic and memory integrated circuits
- Publication number 20060289981
- Publication date Dec 28, 2006
- Robert M. Nickerson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Remote Site Access of a Multi-Core Process...
- Publication number 20060123096
- Publication date Jun 8, 2006
- Brian Carr Taggart
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Power distribution within a folded flex package method and apparatus
- Publication number 20060091508
- Publication date May 4, 2006
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Folded substrate with interposer package for integrated circuit dev...
- Publication number 20060077644
- Publication date Apr 13, 2006
- Robert M. Nickerson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip-chips on flex substrates, flip-chip and wire-bonded chip stack...
- Publication number 20060033217
- Publication date Feb 16, 2006
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-line wire bonding on a package, and method of assembling same
- Publication number 20060001180
- Publication date Jan 5, 2006
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circular wire-bond pad, package made therewith, and method of assem...
- Publication number 20060000876
- Publication date Jan 5, 2006
- Robert Nickerson
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bottom heat spreader
- Publication number 20050285260
- Publication date Dec 29, 2005
- Dale Hackitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic assembly having a redistribution conductor over a m...
- Publication number 20050230850
- Publication date Oct 20, 2005
- Brian C. Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lower profile flexible substrate package for electronic components
- Publication number 20050214978
- Publication date Sep 29, 2005
- Brian Taggart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for trace shielding and routing on a substrate
- Publication number 20050133255
- Publication date Jun 23, 2005
- Intel Corporation (a Delaware corporation)
- John Conner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bond finger on via substrate, process of making same, package made...
- Publication number 20040262039
- Publication date Dec 30, 2004
- Brian Taggart
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Brian Taggart

Person

Patents Grantslast 30 patents

Integrated circuit device mounting with folded substrate and interp...

Method and apparatus for trace shielding and routing on a substrate

Microelectronic package having a stiffening element and method of m...

Folded substrate with interposer package for integrated circuit dev...

Power distribution within a folded flex package method and apparatus

Bond finger on via substrate, process of making same, package made...

Circular wire-bond pad, package made therewith, and method of assem...

Bottom heat spreader

Patents Applicationslast 30 patents

FOLDED SUBSTRATE WITH INTERPOSER PACKAGE FOR INTEGRATED CIRCUIT DEV...

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE...

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEM...

Microelectronic package having a stiffening element and method of m...

Packaging logic and memory integrated circuits

Method and Apparatus for Remote Site Access of a Multi-Core Process...

Power distribution within a folded flex package method and apparatus

Folded substrate with interposer package for integrated circuit dev...

Flip-chips on flex substrates, flip-chip and wire-bonded chip stack...

In-line wire bonding on a package, and method of assembling same

Circular wire-bond pad, package made therewith, and method of assem...

Bottom heat spreader

Microelectronic assembly having a redistribution conductor over a m...

Lower profile flexible substrate package for electronic components

Method and apparatus for trace shielding and routing on a substrate

Bond finger on via substrate, process of making same, package made...