Brooks L. Scofield Jr.

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer level package
- Patent number 5,323,051
- Issue date Jun 21, 1994
- Motorola, Inc.
- Victor J. Adams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bump bonding and sealing an accelerometer chip onto an in...
- Patent number 5,164,328
- Issue date Nov 17, 1992
- Motorola, Inc.
- William C. Dunn
- B81 - MICRO-STRUCTURAL TECHNOLOGY