Bruce A. Myers

Person

Kokomo, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat exchanger equipped with thermal electric device for engine exh...
- Patent number 9,267,415
- Issue date Feb 23, 2016
- Delphi Technologies, Inc.
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Carbon dioxide absorbent fluid for a carbon dioxide sequestering sy...
- Patent number 8,696,804
- Issue date Apr 15, 2014
- Delphi Technologies, Inc.
- David W. Ihms
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Vehicle system to separate and store carbon dioxide from engine exh...
- Patent number 8,480,798
- Issue date Jul 9, 2013
- Delphi Technologies, Inc.
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Thermally-protected chamber for a temperature-sensitive consumer el...
- Patent number 8,438,862
- Issue date May 14, 2013
- Delphi Technologies, Inc.
- Todd P. Oman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid cooled power electronic circuit comprising a stacked array o...
- Patent number 7,795,726
- Issue date Sep 14, 2010
- Delphi Technologies, Inc.
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating component having stair-stepped coolant channels
- Patent number 7,782,616
- Issue date Aug 24, 2010
- Delphi Technologies, Inc.
- Bruce A. Myers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid cooled power electronic circuit comprising stacked direct di...
- Patent number 7,608,924
- Issue date Oct 27, 2009
- Delphi Technologies, Inc.
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of forming a laminate ceramic circuit board
- Patent number 7,574,793
- Issue date Aug 18, 2009
- Delphi Technologies, Inc.
- Dwadasi Hare Rama Sarma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit assembly with surface-mount IC package and heat sink
- Patent number 7,561,436
- Issue date Jul 14, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid cooled electronic assembly
- Patent number 7,551,439
- Issue date Jun 23, 2009
- Delphi Technologies, Inc.
- Darrel E. Peugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package having integral fluid cooling
- Patent number 7,538,425
- Issue date May 26, 2009
- Delphi Technologies, Inc.
- Bruce A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal transient suppression material and method of production
- Patent number 7,498,376
- Issue date Mar 3, 2009
- Delphi Technologies, Inc.
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Fluid-cooled electronic system
- Patent number 7,365,981
- Issue date Apr 29, 2008
- Delphi Technologies, Inc.
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer encapsulated electrical devices
- Patent number 7,352,070
- Issue date Apr 1, 2008
- Delphi Technologies, Inc.
- Thomas S. Ellis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vane integration into motor hub to enhance CD cooling
- Patent number 7,334,243
- Issue date Feb 19, 2008
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- G11 - INFORMATION STORAGE
Information Patent Grant
Laminate ceramic circuit board and process therefor
- Patent number 7,321,098
- Issue date Jan 22, 2008
- Delphi Technologies, Inc.
- Dwadasi Hare Rama Sarma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method of cooling electronics
- Patent number 7,307,841
- Issue date Dec 11, 2007
- Delphi Technologies, Inc.
- Carl W. Berlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip cooling system
- Patent number 7,294,926
- Issue date Nov 13, 2007
- Delphi Technologies, Inc.
- Peter J. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management of surface-mount circuit devices on laminate cer...
- Patent number 7,269,017
- Issue date Sep 11, 2007
- Delphi Technologies, Inc.
- Carl W. Berlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated cooling system for electronic devices
- Patent number 7,215,547
- Issue date May 8, 2007
- Delphi Technologies, Inc.
- Shih-Chia Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly with solder-bonded heat sink
- Patent number 7,132,746
- Issue date Nov 7, 2006
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an electronic package having underfill standoff
- Patent number 7,118,940
- Issue date Oct 10, 2006
- Delphi Technologies, Inc.
- Bruce A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power electronic system with passive cooling
- Patent number 7,106,588
- Issue date Sep 12, 2006
- Delphi Technologies, Inc.
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with localized stiffener for enhanced circuit compone...
- Patent number 7,094,975
- Issue date Aug 22, 2006
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package with integral leadframe convector and me...
- Patent number 6,979,900
- Issue date Dec 27, 2005
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally-conductive electrically-insulating polymer-base material
- Patent number 6,822,018
- Issue date Nov 23, 2004
- Delphi Technologies, Inc.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for forming an electronic assembly
- Patent number 6,807,731
- Issue date Oct 26, 2004
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Overmolded electronic package including circuit-carrying substrate
- Patent number 6,779,260
- Issue date Aug 24, 2004
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally-capacitive phase change encapsulant for electronic devices
- Patent number 6,703,128
- Issue date Mar 9, 2004
- Delphi Technologies, Inc.
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded circuit board with underfilled surface-mount component a...
- Patent number 6,693,239
- Issue date Feb 17, 2004
- Delphi Technologies Inc.
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Thermoelectric Generator To Engine Exhaust Manifold Interface Using...
- Publication number 20170098750
- Publication date Apr 6, 2017
- Delphi Technologies, Inc.
- Carl W. Berlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC GENERATOR TO ENGINE EXHAUST MANIFOLD ASSEMBLY
- Publication number 20140305480
- Publication date Oct 16, 2014
- Delphi Technologies, Inc.
- SCOTT D. BRANDENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOELECTRIC GENERATOR TO ENGINE EXHAUST MANIFOLD ASSEMBLY
- Publication number 20140305481
- Publication date Oct 16, 2014
- SCOTT D. BRANDENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARBON DIOXIDE ABSORBENT FLUID FOR A CARBON DIOXIDE SEQUESTERING SY...
- Publication number 20130220130
- Publication date Aug 29, 2013
- DAVID W. IHMS
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
HEAT EXCHANGER EQUIPPED WITH THERMAL ELECTRIC DEVICE FOR ENGINE EXH...
- Publication number 20130186075
- Publication date Jul 25, 2013
- Delphi Technologies, Inc.
- BRUCE A. MYERS
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
THERMALLY-PROTECTED CHAMBER FOR A TEMPERATURE-SENSITIVE CONSUMER EL...
- Publication number 20110094725
- Publication date Apr 28, 2011
- Delphi Technologies, Inc.
- TODD P. OMAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VISUAL GAP MITIGATION APPARATUS FOR A SEGMENTED DISPLAY PANEL
- Publication number 20110080665
- Publication date Apr 7, 2011
- Delphi Technologies, Inc.
- BRUCE A. MYERS
- G02 - OPTICS
Information Patent Application
Transistor package with wafer level dielectric isolation
- Publication number 20080290378
- Publication date Nov 27, 2008
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid cooled power electronic circuit comprising a stacked array o...
- Publication number 20080272484
- Publication date Nov 6, 2008
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Liquid cooled power electronic circuit comprising stacked direct di...
- Publication number 20080272485
- Publication date Nov 6, 2008
- Delphi Technologies, Inc.
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminate ceramic circuit board and process therefor
- Publication number 20080047136
- Publication date Feb 28, 2008
- DELPHI TECHNOLOGIES, INC.
- Dwadasi Hare Rama Sarma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluid cooled electronic assembly
- Publication number 20070230127
- Publication date Oct 4, 2007
- Delphi Technologies, Inc.
- Darrel E. Peugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip cooling system
- Publication number 20070063337
- Publication date Mar 22, 2007
- Peter J. Schubert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vane integration into motor hub to enhance CD cooling
- Publication number 20070050794
- Publication date Mar 1, 2007
- Suresh K. Chengalva
- G11 - INFORMATION STORAGE
Information Patent Application
Electronic package and method of cooling electronics
- Publication number 20070025081
- Publication date Feb 1, 2007
- Carl W. Berlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluid-cooled electronic system
- Publication number 20060291164
- Publication date Dec 28, 2006
- Bruce A. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT ASSEMBLY WITH SURFACE-MOUNT IC PACKAGE AND HEAT SINK
- Publication number 20060274512
- Publication date Dec 7, 2006
- DELPHI TECHNOLOGIES, INC
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic assembly with integral thermal transient suppression
- Publication number 20060209516
- Publication date Sep 21, 2006
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Audio automatic volume control
- Publication number 20060153405
- Publication date Jul 13, 2006
- Bruce A. Myers
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
THERMAL MANAGEMENT OF SURFACE-MOUNT CIRCUIT DEVICES ON LAMINATE CER...
- Publication number 20060109632
- Publication date May 25, 2006
- DELPHI TECHNOLOGIES, INC
- Carl W. Berlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated cooling system for electronic devices
- Publication number 20060034052
- Publication date Feb 16, 2006
- Shih-Chia Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Surface mount axial leaded component for an electronic module
- Publication number 20060021792
- Publication date Feb 2, 2006
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Power semiconductor package having integral fluid cooling
- Publication number 20060022334
- Publication date Feb 2, 2006
- Bruce A. Myers
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal transient suppression material and method of production
- Publication number 20050287352
- Publication date Dec 29, 2005
- Bruce A. Myers
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
LAMINATE CERAMIC CIRCUIT BOARD AND PROCESS THEREFOR
- Publication number 20050236180
- Publication date Oct 27, 2005
- DELPHI TECHNOLOGIES, INC
- Dwadasi Hare Rama Sarma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally-conductive electrically-insulating polymer-base material
- Publication number 20050137286
- Publication date Jun 23, 2005
- DELPHI TECHNOLOGIES, INC.
- Arun K. Chaudhuri
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit board with localized stiffener for enhanced circuit compone...
- Publication number 20050109534
- Publication date May 26, 2005
- Suresh K. Chengalva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power electronic system with passive cooling
- Publication number 20050088822
- Publication date Apr 28, 2005
- Gary E. Oberlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package with integral leadframe convector and me...
- Publication number 20050082660
- Publication date Apr 21, 2005
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming an electronic assembly
- Publication number 20050081377
- Publication date Apr 21, 2005
- DELPHI TECHNOLOGIES, INC.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Bruce A. Myers

Person

Patents Grantslast 30 patents

Heat exchanger equipped with thermal electric device for engine exh...

Carbon dioxide absorbent fluid for a carbon dioxide sequestering sy...

Vehicle system to separate and store carbon dioxide from engine exh...

Thermally-protected chamber for a temperature-sensitive consumer el...

Liquid cooled power electronic circuit comprising a stacked array o...

Heat-dissipating component having stair-stepped coolant channels

Liquid cooled power electronic circuit comprising stacked direct di...

Process of forming a laminate ceramic circuit board

Circuit assembly with surface-mount IC package and heat sink

Fluid cooled electronic assembly

Power semiconductor package having integral fluid cooling

Thermal transient suppression material and method of production

Fluid-cooled electronic system

Polymer encapsulated electrical devices

Vane integration into motor hub to enhance CD cooling

Laminate ceramic circuit board and process therefor

Electronic package and method of cooling electronics

Chip cooling system

Thermal management of surface-mount circuit devices on laminate cer...

Integrated cooling system for electronic devices

Electronic assembly with solder-bonded heat sink

Method of fabricating an electronic package having underfill standoff

Power electronic system with passive cooling

Circuit board with localized stiffener for enhanced circuit compone...

Integrated circuit package with integral leadframe convector and me...

Thermally-conductive electrically-insulating polymer-base material

Method for forming an electronic assembly

Overmolded electronic package including circuit-carrying substrate

Thermally-capacitive phase change encapsulant for electronic devices

Overmolded circuit board with underfilled surface-mount component a...

Patents Applicationslast 30 patents

Thermoelectric Generator To Engine Exhaust Manifold Interface Using...

THERMOELECTRIC GENERATOR TO ENGINE EXHAUST MANIFOLD ASSEMBLY

THERMOELECTRIC GENERATOR TO ENGINE EXHAUST MANIFOLD ASSEMBLY

CARBON DIOXIDE ABSORBENT FLUID FOR A CARBON DIOXIDE SEQUESTERING SY...

HEAT EXCHANGER EQUIPPED WITH THERMAL ELECTRIC DEVICE FOR ENGINE EXH...

THERMALLY-PROTECTED CHAMBER FOR A TEMPERATURE-SENSITIVE CONSUMER EL...

VISUAL GAP MITIGATION APPARATUS FOR A SEGMENTED DISPLAY PANEL

Transistor package with wafer level dielectric isolation

Liquid cooled power electronic circuit comprising a stacked array o...

Liquid cooled power electronic circuit comprising stacked direct di...

Laminate ceramic circuit board and process therefor

Fluid cooled electronic assembly

Chip cooling system

Vane integration into motor hub to enhance CD cooling

Electronic package and method of cooling electronics

Fluid-cooled electronic system

CIRCUIT ASSEMBLY WITH SURFACE-MOUNT IC PACKAGE AND HEAT SINK

Electronic assembly with integral thermal transient suppression

Audio automatic volume control

THERMAL MANAGEMENT OF SURFACE-MOUNT CIRCUIT DEVICES ON LAMINATE CER...

Integrated cooling system for electronic devices

Surface mount axial leaded component for an electronic module

Power semiconductor package having integral fluid cooling

Thermal transient suppression material and method of production

LAMINATE CERAMIC CIRCUIT BOARD AND PROCESS THEREFOR

Thermally-conductive electrically-insulating polymer-base material

Circuit board with localized stiffener for enhanced circuit compone...

Power electronic system with passive cooling

Integrated circuit package with integral leadframe convector and me...

Method for forming an electronic assembly