Bruce Euzent

Follow

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 8,212,353
- Issue date Jul 3, 2012
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 7,741,160
- Issue date Jun 22, 2010
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and assembly procedure for low stress thin die flip chip...
- Patent number 7,585,702
- Issue date Sep 8, 2009
- Altera Corporation
- Wen-chou Vincent Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for assessing reliability of assemblies using...
- Patent number 7,210,081
- Issue date Apr 24, 2007
- Altera Corporation
- Bruce Euzent
- G01 - MEASURING TESTING