Bruce J. CHAMBERLIN

Person

Vestal, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabricating an asymmetric printed circuit board with minimized warpage
- Patent number 11,523,519
- Issue date Dec 6, 2022
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Selective dielectric resin application on circuitized core layers
- Patent number 11,178,757
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-destructive identifying of plating dissolution in soldered, pla...
- Patent number 11,059,120
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Matthew S. Kelly
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass-free dielectric layers for printed circuit boards
- Patent number 10,982,060
- Issue date Apr 20, 2021
- International Business Machines Corporation
- Joseph Kuczynski
- B32 - LAYERED PRODUCTS
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 10,959,339
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass fiber coatings for improved resistance to conductive anodic f...
- Patent number 10,932,363
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Bruce J. Chamberlin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Glass cloth including attached fibers
- Patent number 10,801,137
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Bruce J. Chamberlin
- D03 - WEAVING
Information Patent Grant
Compliant pin with self sensing deformation
- Patent number 10,768,245
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Matthew S. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ detection of glass fiber defects
- Patent number 10,684,220
- Issue date Jun 16, 2020
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via stub elimination by disrupting plating
- Patent number 10,674,613
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via stub elimination by disrupting plating
- Patent number 10,617,014
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid immersion techniques for improved resistance to conductive a...
- Patent number 10,590,037
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Bruce J. Chamberlin
- D10 - INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEX...
Information Patent Grant
In-situ detection of hollow glass fiber formation
- Patent number 10,578,551
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Eric J. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating for limiting substrate damage due to discrete failure
- Patent number 10,492,289
- Issue date Nov 26, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating for limiting substrate damage due to discrete failure
- Patent number 10,470,290
- Issue date Nov 5, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass fiber coatings for improved resistance to conductive anodic f...
- Patent number 10,462,900
- Issue date Oct 29, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Selective dielectric resin application on circuitized core layers
- Patent number 10,405,421
- Issue date Sep 3, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,342,122
- Issue date Jul 2, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Via stub elimination by disrupting plating
- Patent number 10,212,828
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Minimizing printed circuit board warpage
- Patent number 10,194,537
- Issue date Jan 29, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and methods to enhance reliability
- Patent number 10,172,243
- Issue date Jan 1, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for embedding a discrete electrical device in a printed circ...
- Patent number 10,149,388
- Issue date Dec 4, 2018
- International Business Machines, Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interface for limiting substrate damage due to discrete failure
- Patent number 10,080,283
- Issue date Sep 18, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 10,010,000
- Issue date Jun 26, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate containing low-Dk-core glass fibers having low dielectric...
- Patent number 9,986,637
- Issue date May 29, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
In-situ detection of hollow glass fiber formation
- Patent number 9,863,875
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Eric J. Campbell
- G01 - MEASURING TESTING
Information Patent Grant
Embedding a discrete electrical device in a printed circuit board
- Patent number 9,839,131
- Issue date Dec 5, 2017
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate containing low-Dk-core glass fibers having low dielectric...
- Patent number 9,456,496
- Issue date Sep 27, 2016
- International Business Machines Corporation
- Bruce J. Chamberlin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing a product using a soldering process
- Patent number 9,398,702
- Issue date Jul 19, 2016
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plated through hole void detection in printed circuit boards by det...
- Patent number 9,250,192
- Issue date Feb 2, 2016
- International Business Machines Corporation
- Bruce John Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...
- Publication number 20200139466
- Publication date May 7, 2020
- International Business Machines Corporation
- Matthew S. KELLY
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPLIANT PIN WITH SELF SENSING DEFORMATION
- Publication number 20200103454
- Publication date Apr 2, 2020
- International Business Machines Corporation
- Matthew S. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...
- Publication number 20190364659
- Publication date Nov 28, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190342994
- Publication date Nov 7, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190342995
- Publication date Nov 7, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS-FREE DIELECTRIC LAYERS FOR PRINTED CIRCUIT BOARDS
- Publication number 20190248970
- Publication date Aug 15, 2019
- International Business Machines Corporation
- JOSEPH KUCZYNSKI
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190191558
- Publication date Jun 20, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS
- Publication number 20190191559
- Publication date Jun 20, 2019
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA STUB ELIMINATION BY DISRUPTING PLATING
- Publication number 20190182968
- Publication date Jun 13, 2019
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VIA STUB ELIMINATION BY DISRUPTING PLATING
- Publication number 20190182967
- Publication date Jun 13, 2019
- International Business Machines Corporation
- Joseph Kuczynski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MINIMIZING PRINTED CIRCUIT BOARD WARPAGE
- Publication number 20190141841
- Publication date May 9, 2019
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interface for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180332701
- Publication date Nov 15, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coating for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180324944
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interface for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180324945
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318968
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Solder for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180318969
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Coating for Limiting Substrate Damage Due to Discrete Failure
- Publication number 20180324946
- Publication date Nov 8, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID IMMERSION TECHNIQUES FOR IMPROVED RESISTANCE TO CONDUCTIVE A...
- Publication number 20180273426
- Publication date Sep 27, 2018
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...
- Publication number 20180153042
- Publication date May 31, 2018
- International Business Machines Corporation
- BRUCE J. CHAMBERLIN
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PRINTED CIRCUIT BOARD AND METHODS TO ENHANCE RELIABILITY
- Publication number 20180139852
- Publication date May 17, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20180139851
- Publication date May 17, 2018
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IN-SITU DETECTION OF HOLLOW GLASS FIBER FORMATION
- Publication number 20180106718
- Publication date Apr 19, 2018
- International Business Machines Corporation
- ERIC J. CAMPBELL
- G01 - MEASURING TESTING
Information Patent Application
IN-SITU DETECTION OF HOLLOW GLASS FIBER FORMATION
- Publication number 20180106719
- Publication date Apr 19, 2018
- International Business Machines Corporation
- ERIC J. CAMPBELL
- G01 - MEASURING TESTING
Information Patent Application
GLASS CLOTH INCLUDING ATTACHED FIBERS
- Publication number 20180023225
- Publication date Jan 25, 2018
- International Business Machines Corporation
- Bruce J. Chamberlin
- D03 - WEAVING
Information Patent Application
EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD
- Publication number 20170118844
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD
- Publication number 20170118842
- Publication date Apr 27, 2017
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC...
- Publication number 20160330834
- Publication date Nov 10, 2016
- International Business Machines Corporation
- Bruce J. Chamberlin
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20160270240
- Publication date Sep 15, 2016
- International Business Machines Corporation
- Bruce J. CHAMBERLIN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC...
- Publication number 20160242280
- Publication date Aug 18, 2016
- International Business Machines Corporation
- Bruce J. Chamberlin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
MANUFACTURING A PRODUCT USING A SOLDERING PROCESS
- Publication number 20140345123
- Publication date Nov 27, 2014
- International Business Machines Corporation
- Bruce J. Chamberlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Bruce J. CHAMBERLIN

Person

Patents Grantslast 30 patents

Fabricating an asymmetric printed circuit board with minimized warpage

Selective dielectric resin application on circuitized core layers

Non-destructive identifying of plating dissolution in soldered, pla...

Glass-free dielectric layers for printed circuit boards

Manufacturing a product using a soldering process

Glass fiber coatings for improved resistance to conductive anodic f...

Glass cloth including attached fibers

Compliant pin with self sensing deformation

In-situ detection of glass fiber defects

Via stub elimination by disrupting plating

Via stub elimination by disrupting plating

Liquid immersion techniques for improved resistance to conductive a...

In-situ detection of hollow glass fiber formation

Coating for limiting substrate damage due to discrete failure

Coating for limiting substrate damage due to discrete failure

Glass fiber coatings for improved resistance to conductive anodic f...

Selective dielectric resin application on circuitized core layers

Interface for limiting substrate damage due to discrete failure

Via stub elimination by disrupting plating

Minimizing printed circuit board warpage

Printed circuit board and methods to enhance reliability

Method for embedding a discrete electrical device in a printed circ...

Interface for limiting substrate damage due to discrete failure

Manufacturing a product using a soldering process

Substrate containing low-Dk-core glass fibers having low dielectric...

In-situ detection of hollow glass fiber formation

Embedding a discrete electrical device in a printed circuit board

Substrate containing low-Dk-core glass fibers having low dielectric...

Manufacturing a product using a soldering process

Plated through hole void detection in printed circuit boards by det...

Patents Applicationslast 30 patents

NON-DESTRUCTIVE IDENTIFYING OF PLATING DISSOLUTION IN SOLDERED, PLA...

COMPLIANT PIN WITH SELF SENSING DEFORMATION

GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

GLASS-FREE DIELECTRIC LAYERS FOR PRINTED CIRCUIT BOARDS

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS

VIA STUB ELIMINATION BY DISRUPTING PLATING

VIA STUB ELIMINATION BY DISRUPTING PLATING

MINIMIZING PRINTED CIRCUIT BOARD WARPAGE

Interface for Limiting Substrate Damage Due to Discrete Failure

Coating for Limiting Substrate Damage Due to Discrete Failure

Interface for Limiting Substrate Damage Due to Discrete Failure

Solder for Limiting Substrate Damage Due to Discrete Failure

Solder for Limiting Substrate Damage Due to Discrete Failure

Coating for Limiting Substrate Damage Due to Discrete Failure

LIQUID IMMERSION TECHNIQUES FOR IMPROVED RESISTANCE TO CONDUCTIVE A...

GLASS FIBER COATINGS FOR IMPROVED RESISTANCE TO CONDUCTIVE ANODIC F...

PRINTED CIRCUIT BOARD AND METHODS TO ENHANCE RELIABILITY

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

IN-SITU DETECTION OF HOLLOW GLASS FIBER FORMATION

IN-SITU DETECTION OF HOLLOW GLASS FIBER FORMATION

GLASS CLOTH INCLUDING ATTACHED FIBERS

EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD

EMBEDDING A DISCRETE ELECTRICAL DEVICE IN A PRINTED CIRCUIT BOARD

SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC...

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS

SUBSTRATE CONTAINING LOW-Dk-CORE GLASS FIBERS HAVING LOW DIELECTRIC...

MANUFACTURING A PRODUCT USING A SOLDERING PROCESS