Bruce J. Freyman

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Control of under-fill using a dam on a packaging substrate for a du...
- Patent number 11,201,066
- Issue date Dec 14, 2021
- Skyworks Solutions, Inc.
- Robert Francis Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grid array assembly of circuit boards with singulation grooves
- Patent number 6,329,606
- Issue date Dec 11, 2001
- Amkor Technology, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier strip and molded flex circuit ball grid array and method of...
- Patent number 6,124,637
- Issue date Sep 26, 2000
- Amkor Technology, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a molded flex circuit ball grid array
- Patent number 5,985,695
- Issue date Nov 16, 1999
- Amkor Technology, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier strip and molded flex circuit ball grid array
- Patent number 5,859,475
- Issue date Jan 12, 1999
- Amkor Technology, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making grid array assembly
- Patent number 5,852,870
- Issue date Dec 29, 1998
- Amkor Technology, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold runner removal from a substrate-based packaged electronic device
- Patent number 5,635,671
- Issue date Jun 3, 1997
- Amkor Electronics, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...
- Publication number 20220130686
- Publication date Apr 28, 2022
- Skyworks Solutions, Inc.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROL OF UNDER-FILL USING A DAM ON A PACKAGING SUBSTRATE FOR A DU...
- Publication number 20180226273
- Publication date Aug 9, 2018
- SKYWORKS SOLUTIONS, INC.
- Robert Francis DARVEAUX
- H01 - BASIC ELECTRIC ELEMENTS

Bruce J. Freyman

Person

Patents Grantslast 30 patents

Control of under-fill using a dam on a packaging substrate for a du...

Grid array assembly of circuit boards with singulation grooves

Carrier strip and molded flex circuit ball grid array and method of...

Method of making a molded flex circuit ball grid array

Carrier strip and molded flex circuit ball grid array

Method of making grid array assembly

Mold runner removal from a substrate-based packaged electronic device

Patents Applicationslast 30 patents

CONTROL OF UNDER-FILL USING AN ENCAPSULANT AND A TRENCH OR DAM FOR...

CONTROL OF UNDER-FILL USING A DAM ON A PACKAGING SUBSTRATE FOR A DU...