Bruce Kenneth Furman

Person

Poughguang, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Concentrator-type photovoltaic (CPV) modules, receiver and sub-rece...
- Patent number 10,416,425
- Issue date Sep 17, 2019
- X-CELEPRINT LIMITED
- Etienne Menard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,927,087
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,617,689
- Issue date Dec 31, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo-compression bonded electrical interconnect structure and method
- Patent number 8,541,291
- Issue date Sep 24, 2013
- Ultratech, Inc.
- Bruce K. Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect forming method
- Patent number 8,541,299
- Issue date Sep 24, 2013
- Ultratech, Inc.
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect structure
- Patent number 8,476,773
- Issue date Jul 2, 2013
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnect forming method
- Patent number 8,242,010
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding of substrates including metal-dielectric patterns with meta...
- Patent number 8,241,995
- Issue date Aug 14, 2012
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermo-compression bonded electrical interconnect structure
- Patent number 8,164,192
- Issue date Apr 24, 2012
- International Business Machines Corporation
- Bruce K. Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Patterned metal thermal interface
- Patent number 8,156,998
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Thermo-compression bonded electrical interconnect structure and method
- Patent number 8,043,893
- Issue date Oct 25, 2011
- International Business Machines Corporation
- Bruce K. Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Devices and methods for side-coupling optical fibers to optoelectro...
- Patent number 8,002,477
- Issue date Aug 23, 2011
- International Business Machines Corporation
- Evan George Colgan
- G02 - OPTICS
Information Patent Grant
Cooling apparatus with cold plate formed in situ on a surface to be...
- Patent number 7,978,473
- Issue date Jul 12, 2011
- International Business Machines Corporation
- Levi A. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for deploying a liquid metal thermal interface...
- Patent number 7,952,193
- Issue date May 31, 2011
- International Business Machines Corporation
- Bruce K. Furman
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Structure and methods of processing for solder thermal interface ma...
- Patent number 7,898,076
- Issue date Mar 1, 2011
- International Business Machines Corporation
- Bruce Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-compression bonded electrical interconnect structure and method
- Patent number 7,868,457
- Issue date Jan 11, 2011
- International Business Machines Corporation
- Bruce K. Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for encapsulating microelectromechanical (MEM) devices on a...
- Patent number 7,863,070
- Issue date Jan 4, 2011
- International Business Machines Corporation
- Evan G. Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Layer transfer process and functionally enhanced integrated circuit...
- Patent number 7,855,101
- Issue date Dec 21, 2010
- International Business Machines Corporation
- Bruce K. Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package method and structure with cure-melt hierarchy
- Patent number 7,834,442
- Issue date Nov 16, 2010
- International Business Machines Corporation
- Bruce K Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for cooling a surface
- Patent number 7,804,048
- Issue date Sep 28, 2010
- International Business Machines Corporation
- Bruce K. Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic seal and reliable bonding structures for 3D applications
- Patent number 7,786,596
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure and method
- Patent number 7,786,001
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooling apparatus and method of fabrication thereof with a cold pla...
- Patent number 7,731,079
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Levi A. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned metal thermal interface
- Patent number 7,694,719
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Hermetic seal and reliable bonding structures for 3D applications
- Patent number 7,683,478
- Issue date Mar 23, 2010
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for isotropic etching of copper
- Patent number 7,537,709
- Issue date May 26, 2009
- International Business Machines Corporation
- Emanuel I. Cooper
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for deploying a liquid metal thermal interface...
- Patent number 7,482,197
- Issue date Jan 27, 2009
- International Business Machines Corporation
- Bruce K. Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods for side-coupling optical fibers to optoelectro...
- Patent number 7,440,668
- Issue date Oct 21, 2008
- International Business Machines Corporation
- Evan George Colgan
- G02 - OPTICS
Information Patent Grant
Polycrystalline conducting polymers having adjustable morphology an...
- Patent number 7,404,914
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Apparatus and methods for encapsulating microelectromechanical (MEM...
- Patent number 7,344,907
- Issue date Mar 18, 2008
- International Business Machines Corporation
- Evan G. Colgan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20140097543
- Publication date Apr 10, 2014
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-MOUNTABLE LENS CRADLES AND INTERCONNECTION STRUCTURES FOR C...
- Publication number 20140034127
- Publication date Feb 6, 2014
- Semprius, Inc.
- Matthew Meitl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20130307139
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH CONCENTRATION PHOTOVOLTAIC MODULES AND METHODS OF FABRICATING...
- Publication number 20130146120
- Publication date Jun 13, 2013
- Steven Seel
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MOISTURE-PROOF EXPANSION CHAMBER FOR EQUALIZING PRESSURE IN SEALED...
- Publication number 20130125956
- Publication date May 23, 2013
- Bruce Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE
- Publication number 20110240279
- Publication date Oct 6, 2011
- International Business Machines Corporation
- BRUCE K. Furman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
- Publication number 20110239458
- Publication date Oct 6, 2011
- International Business Machines Corporation
- Bruce K. Furman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE
- Publication number 20110095431
- Publication date Apr 28, 2011
- International Business Machines Corporation
- Bruce K. Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...
- Publication number 20100255262
- Publication date Oct 7, 2010
- Kuan-Neng Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Concentrator-Type Photovoltaic (CPV) Modules, Receiver and Sub-Rece...
- Publication number 20100236603
- Publication date Sep 23, 2010
- Etienne Menard
- G02 - OPTICS
Information Patent Application
ELECTRICAL INTERCONNECT FORMING METHOD
- Publication number 20100230475
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE
- Publication number 20100230143
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRICAL INTERCONNECT FORMING METHOD
- Publication number 20100230474
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Stephen Leslie Buchwalter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PATTERNED METAL THERMAL INTERFACE
- Publication number 20100147497
- Publication date Jun 17, 2010
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
COOLING APPARATUS WITH COLD PLATE FORMED IN SITU ON A SURFACE TO BE...
- Publication number 20100142150
- Publication date Jun 10, 2010
- International Business Machines Corporation
- Levi A. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYER TRANSFER PROCESS AND FUNCTIONALLY ENHANCED INTEGRATED CIRCUIT...
- Publication number 20100081232
- Publication date Apr 1, 2010
- International Business Machines Corporation
- Bruce K. Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLA...
- Publication number 20090316360
- Publication date Dec 24, 2009
- International Business Machines Corporation
- Levi A. CAMPBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Layer Transfer Processing
- Publication number 20090233079
- Publication date Sep 17, 2009
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE METHOD AND STRUCTURE WITH CURE-MELT HIERARCHY
- Publication number 20090179322
- Publication date Jul 16, 2009
- International Business Machines Corporation
- BRUCE K FURMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
- Publication number 20090140404
- Publication date Jun 4, 2009
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR DEPLOYING A LIQUID METAL THERMAL INTERFACE...
- Publication number 20090142532
- Publication date Jun 4, 2009
- BRUCE K. FURMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
- Publication number 20090075469
- Publication date Mar 19, 2009
- Bruce K. Furman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
- Publication number 20090072407
- Publication date Mar 19, 2009
- Bruce K. Furman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEAGGREGATED ELECTRICALLY CONDUCTIVE POLYMERS AND PRECURSORS THEREOF
- Publication number 20090032774
- Publication date Feb 5, 2009
- Marie Angelopoulos
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DEVICES AND METHODS FOR SIDE-COUPLING OPTICAL FIBERS TO OPTOELECTRO...
- Publication number 20080282742
- Publication date Nov 20, 2008
- Evan George COLGAN
- G02 - OPTICS
Information Patent Application
Techniques for Layer Transfer Processing
- Publication number 20080280416
- Publication date Nov 13, 2008
- International Business Machines Corporation
- Stephen W. Bedell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Layer Transfer Process and Functionally Enhanced Integrated Circuit...
- Publication number 20080277778
- Publication date Nov 13, 2008
- Bruce K. Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS
- Publication number 20080268574
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Kuan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Methods of Processing for Solder Thermal Interface Ma...
- Publication number 20080265404
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Bruce Furman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE AND METHOD
- Publication number 20080251281
- Publication date Oct 16, 2008
- Stephen Leslie Buchwalter
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Bruce Kenneth Furman

Person

Patents Grantslast 30 patents

Concentrator-type photovoltaic (CPV) modules, receiver and sub-rece...

Bonding of substrates including metal-dielectric patterns with meta...

Bonding of substrates including metal-dielectric patterns with meta...

Thermo-compression bonded electrical interconnect structure and method

Electrical interconnect forming method

Electrical interconnect structure

Electrical interconnect forming method

Bonding of substrates including metal-dielectric patterns with meta...

Thermo-compression bonded electrical interconnect structure

Patterned metal thermal interface

Thermo-compression bonded electrical interconnect structure and method

Devices and methods for side-coupling optical fibers to optoelectro...

Cooling apparatus with cold plate formed in situ on a surface to be...

Method and apparatus for deploying a liquid metal thermal interface...

Structure and methods of processing for solder thermal interface ma...

Thermo-compression bonded electrical interconnect structure and method

Methods for encapsulating microelectromechanical (MEM) devices on a...

Layer transfer process and functionally enhanced integrated circuit...

Electronic package method and structure with cure-melt hierarchy

Structure for cooling a surface

Hermetic seal and reliable bonding structures for 3D applications

Electrical interconnect structure and method

Cooling apparatus and method of fabrication thereof with a cold pla...

Patterned metal thermal interface

Hermetic seal and reliable bonding structures for 3D applications

Method for isotropic etching of copper

Method and apparatus for deploying a liquid metal thermal interface...

Devices and methods for side-coupling optical fibers to optoelectro...

Polycrystalline conducting polymers having adjustable morphology an...

Apparatus and methods for encapsulating microelectromechanical (MEM...

Patents Applicationslast 30 patents

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

SURFACE-MOUNTABLE LENS CRADLES AND INTERCONNECTION STRUCTURES FOR C...

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

HIGH CONCENTRATION PHOTOVOLTAIC MODULES AND METHODS OF FABRICATING...

MOISTURE-PROOF EXPANSION CHAMBER FOR EQUALIZING PRESSURE IN SEALED...

HYBRID LIQUID METAL-SOLDER THERMAL INTERFACE

THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD

THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE

BONDING OF SUBSTRATES INCLUDING METAL-DIELECTRIC PATTERNS WITH META...

Concentrator-Type Photovoltaic (CPV) Modules, Receiver and Sub-Rece...

ELECTRICAL INTERCONNECT FORMING METHOD

ELECTRICAL INTERCONNECT STRUCTURE

ELECTRICAL INTERCONNECT FORMING METHOD

PATTERNED METAL THERMAL INTERFACE

COOLING APPARATUS WITH COLD PLATE FORMED IN SITU ON A SURFACE TO BE...

LAYER TRANSFER PROCESS AND FUNCTIONALLY ENHANCED INTEGRATED CIRCUIT...

COOLING APPARATUS AND METHOD OF FABRICATION THEREOF WITH A COLD PLA...

Techniques for Layer Transfer Processing

ELECTRONIC PACKAGE METHOD AND STRUCTURE WITH CURE-MELT HIERARCHY

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS

METHOD AND APPARATUS FOR DEPLOYING A LIQUID METAL THERMAL INTERFACE...

THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD

THERMO-COMPRESSION BONDED ELECTRICAL INTERCONNECT STRUCTURE AND METHOD

DEAGGREGATED ELECTRICALLY CONDUCTIVE POLYMERS AND PRECURSORS THEREOF

DEVICES AND METHODS FOR SIDE-COUPLING OPTICAL FIBERS TO OPTOELECTRO...

Techniques for Layer Transfer Processing

Layer Transfer Process and Functionally Enhanced Integrated Circuit...

HERMETIC SEAL AND RELIABLE BONDING STRUCTURES FOR 3D APPLICATIONS

Structure and Methods of Processing for Solder Thermal Interface Ma...

ELECTRICAL INTERCONNECT STRUCTURE AND METHOD