Bruce W. Worster

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for characterizing defects on semiconductor wafers
- Patent number 7,384,806
- Issue date Jun 10, 2008
- KLA-Tencor Corporation
- Bruce W. Worster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for characterizing defects on semiconductor wafers
- Patent number 7,154,605
- Issue date Dec 26, 2006
- KLA-Tencor Corporation
- Bruce W. Worster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for characterizing defects on semiconductor wafers
- Patent number 6,661,515
- Issue date Dec 9, 2003
- KLA-Tencor Corporation
- Bruce W. Worster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for characterizing defects on semiconductor wafers
- Patent number 6,288,782
- Issue date Sep 11, 2001
- Ultrapointe Corporation
- Bruce W. Worster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for inspecting the surface of a wafer
- Patent number 6,167,148
- Issue date Dec 26, 2000
- Ultrapointe Corporation
- Louis D. Calitz
- G01 - MEASURING TESTING
Information Patent Grant
Integrated laser imaging and spectral analysis system
- Patent number 6,069,690
- Issue date May 30, 2000
- Uniphase Corporation
- James J. Xu
- G01 - MEASURING TESTING
Information Patent Grant
Laser imaging system for inspection and analysis of sub-micron part...
- Patent number 5,963,314
- Issue date Oct 5, 1999
- Ultrapointe Corporation
- Bruce W. Worster
- G02 - OPTICS
Information Patent Grant
Method for characterizing defects on semiconductor wafers
- Patent number 5,923,430
- Issue date Jul 13, 1999
- Ultrapointe Corporation
- Bruce W. Worster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for characterizing defects on semiconductor wafers
- Patent number 5,808,735
- Issue date Sep 15, 1998
- Ultrapointe Corporation
- Ken K. Lee
- G02 - OPTICS
Information Patent Grant
Laser imaging system for inspection and analysis of sub-micron part...
- Patent number 5,479,252
- Issue date Dec 26, 1995
- Ultrapointe Corporation
- Bruce W. Worster
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Method for Characterizing Defects on Semiconductor Wafers
- Publication number 20070104357
- Publication date May 10, 2007
- KLA-Tencor Corporation
- Bruce W. Worster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for characterizing defects on semiconductor wafers
- Publication number 20030203520
- Publication date Oct 30, 2003
- Bruce W. Worster
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for characterizing defects on semiconductor wafers
- Publication number 20020012118
- Publication date Jan 31, 2002
- Bruce W. Worster
- G01 - MEASURING TESTING

Bruce W. Worster

Person

Patents Grantslast 30 patents

Method for characterizing defects on semiconductor wafers

Method for characterizing defects on semiconductor wafers

Method for characterizing defects on semiconductor wafers

Method for characterizing defects on semiconductor wafers

Method and system for inspecting the surface of a wafer

Integrated laser imaging and spectral analysis system

Laser imaging system for inspection and analysis of sub-micron part...

Method for characterizing defects on semiconductor wafers

Method for characterizing defects on semiconductor wafers

Laser imaging system for inspection and analysis of sub-micron part...

Patents Applicationslast 30 patents

Method for Characterizing Defects on Semiconductor Wafers

Method for characterizing defects on semiconductor wafers

Method for characterizing defects on semiconductor wafers