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Bruno Spuler
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Wappingers Falls, NY, US
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last 30 patents
Information
Patent Grant
Method for patterning integrated circuit conductors
Patent number
6,071,820
Issue date
Jun 6, 2000
Siemens Aktiengesellschaft
Virinder Grewal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual damascene with bond pads
Patent number
6,033,984
Issue date
Mar 7, 2000
Siemens Aktiengesellschaft
Rainer Florian Schnabel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Deposition of carbon into nitride layer for improved selectivity of...
Patent number
5,935,873
Issue date
Aug 10, 1999
Siemens Aktiengesellschaft
Bruno Spuler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming metallization in semiconductor devices with a se...
Patent number
5,854,126
Issue date
Dec 29, 1998
Siemens Aktiengesellschaft
Dirk Tobben
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for metal etching with reduced sidewall build up during int...
Patent number
5,846,884
Issue date
Dec 8, 1998
Siemens Aktiengesellschaft
Munir D. Naeem
H01 - BASIC ELECTRIC ELEMENTS