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Bryan Pennington
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Tualatin, OR, US
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Patents Grants
last 30 patents
Information
Patent Grant
Monitoring surface oxide on seed layers during electroplating
Patent number
11,208,732
Issue date
Dec 28, 2021
Lam Research Corporation
Ludan Huang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Monitoring surface oxide on seed layers during electroplating
Patent number
10,443,146
Issue date
Oct 15, 2019
Lam Research Corporation
Ludan Huang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Gap fill process stability monitoring of an electroplating process...
Patent number
10,358,738
Issue date
Jul 23, 2019
Lam Research Corporation
Quan Ma
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Pulse sequence for plating on thin seed layers
Patent number
8,500,983
Issue date
Aug 6, 2013
Novellus Systems, Inc.
Thomas A. Ponnuswamy
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and apparatus for electroplating
Patent number
8,308,931
Issue date
Nov 13, 2012
Novellus Systems, Inc.
Jonathan Reid
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Patents Applications
last 30 patents
Information
Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
Publication number
20190390361
Publication date
Dec 26, 2019
LAM RESEARCH CORPORATION
Ludan Huang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
Publication number
20180282894
Publication date
Oct 4, 2018
LAM RESEARCH CORPORATION
Ludan Huang
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
GAP FILL PROCESS STABILITY MONITORING OF AN ELECTROPLATING PROCESS...
Publication number
20180080140
Publication date
Mar 22, 2018
LAM RESEARCH CORPORATION
Quan Ma
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PULSE SEQUENCE FOR PLATING ON THIN SEED LAYERS
Publication number
20100300888
Publication date
Dec 2, 2010
Thomas A. Ponnuswamy
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Method and apparatus for electroplating
Publication number
20100032310
Publication date
Feb 11, 2010
Novellus Systems, Inc.
Jonathan Reid
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR