Bryan Pu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for shaping a magnetic field in a magnetic fie...
- Patent number 8,936,696
- Issue date Jan 20, 2015
- Applied Materials, Inc.
- Roger Alan Lindley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pulsed bias plasma process to control microloading
- Patent number 8,609,546
- Issue date Dec 17, 2013
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of controlling etch microloading for a tungsten-containing l...
- Patent number 8,518,282
- Issue date Aug 27, 2013
- Lam Research Corporation
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma reactor apparatus with multiple gas injection zones having t...
- Patent number 8,231,799
- Issue date Jul 31, 2012
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch reactor with distribution of etch gases across a wafer...
- Patent number 8,187,415
- Issue date May 29, 2012
- Applied Materials, Inc.
- Jong Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for shaping a magnetic field in a magnetic fie...
- Patent number 7,879,186
- Issue date Feb 1, 2011
- Applied Materials, Inc.
- Roger Alan Lindley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control using dual cathode frequency mixing
- Patent number 7,838,430
- Issue date Nov 23, 2010
- Applied Materials, Inc.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Halogen-free amorphous carbon mask etch having high selectivity to...
- Patent number 7,807,064
- Issue date Oct 5, 2010
- Applied Materials, Inc.
- Jong Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma control using dual cathode frequency mixing and controlling...
- Patent number 7,736,914
- Issue date Jun 15, 2010
- Applied Materials, Inc.
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing microloading in etching high aspect ratio struc...
- Patent number 7,629,255
- Issue date Dec 8, 2009
- Lam Research Corporation
- Qian Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch process with separately fed carbon-lean and carbon-rich...
- Patent number 7,541,292
- Issue date Jun 2, 2009
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch process using polymerizing etch gases across a wafer su...
- Patent number 7,540,971
- Issue date Jun 2, 2009
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to open carbon based hardmask
- Patent number 7,432,210
- Issue date Oct 7, 2008
- Applied Materials, Inc.
- Judy Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etch process using polymerizing etch gases with different et...
- Patent number 7,431,859
- Issue date Oct 7, 2008
- Applied Materials, Inc.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for shaping a magnetic field in a magnetic fie...
- Patent number 7,422,654
- Issue date Sep 9, 2008
- Applied Materials, Inc.
- Roger Alan Lindley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing uniform plasma in a magnetic fie...
- Patent number 7,374,636
- Issue date May 20, 2008
- Applied Materials, Inc.
- Keiji Horioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for uniformly etching a dielectric layer
- Patent number 7,316,761
- Issue date Jan 8, 2008
- Applied Materials, Inc.
- Kenny L. Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for controlling the magnetic field intensity i...
- Patent number 7,316,199
- Issue date Jan 8, 2008
- Applied Materials, Inc.
- Keiji Horioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature controlled window with a fluid supply system
- Patent number 6,916,399
- Issue date Jul 12, 2005
- Yan Rozenzon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring dimensions of features at different locations in the pro...
- Patent number 6,829,056
- Issue date Dec 7, 2004
- Michael Barnes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed inductively-coupled plasma source and circuit for coupl...
- Patent number 6,825,618
- Issue date Nov 30, 2004
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric etch chamber with expanded process window
- Patent number 6,797,639
- Issue date Sep 28, 2004
- Applied Materials Inc.
- James D Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flash step preparatory to dielectric etch
- Patent number 6,787,475
- Issue date Sep 7, 2004
- Zhuxu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric etch chamber with expanded process window
- Patent number 6,716,302
- Issue date Apr 6, 2004
- Applied Materials Inc.
- James D Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield or ring surrounding semiconductor workpiece in plasma chamber
- Patent number 6,689,249
- Issue date Feb 10, 2004
- Applied Materials, Inc.
- Kuang-Han Ke
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
- Patent number 6,613,689
- Issue date Sep 2, 2003
- Applied Materials, Inc.
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distributed inductively-coupled plasma source and circuit for coupl...
- Patent number 6,568,346
- Issue date May 27, 2003
- Applied Materials Inc.
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adjusting DC bias voltage in plasma chamber
- Patent number 6,513,452
- Issue date Feb 4, 2003
- Applied Materials Inc.
- Hongching Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetically enhanced plasma etch process using a heavy fluorocarbo...
- Patent number 6,451,703
- Issue date Sep 17, 2002
- Applied Materials, Inc.
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch method using a dielectric etch chamber with expanded process w...
- Patent number 6,403,491
- Issue date Jun 11, 2002
- Applied Materials, Inc.
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PULSED BIAS PLASMA PROCESS TO CONTROL MICROLOADING
- Publication number 20110281438
- Publication date Nov 17, 2011
- LAM RESEARCH CORPORATION
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CONTROLLING ETCH MICROLOADING FOR A TUNGSTEN-CONTAINING L...
- Publication number 20110151670
- Publication date Jun 23, 2011
- LAM RESEARCH CORPORATION
- Wonchul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SHAPING A MAGNETIC FIELD IN A MAGNETIC FIE...
- Publication number 20110115589
- Publication date May 19, 2011
- Applied Materials, Inc.
- Roger Alan Lindley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CONTROL USING DUAL CATHODE FREQUENCY MIXING
- Publication number 20090142859
- Publication date Jun 4, 2009
- Applied Materials, Inc.
- JINGBAO LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SHAPING A MAGNETIC FIELD IN A MAGNETIC FIE...
- Publication number 20090008033
- Publication date Jan 8, 2009
- Applied Materials, Inc.
- Roger Alan Lindley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING MICROLOADING IN ETCHING HIGH ASPECT RATIO STRUC...
- Publication number 20080296736
- Publication date Dec 4, 2008
- LAM RESEARCH CORPORATION
- Qian Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to open carbon based hardmask overlying a dielectric layer
- Publication number 20080286977
- Publication date Nov 20, 2008
- Judy Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALOGEN-FREE AMORPHOUS CARBON MASK ETCH HAVING HIGH SELECTIVITY TO...
- Publication number 20080230511
- Publication date Sep 25, 2008
- APPLIED MATERIALS, INC.
- Jong Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR ETCHING HIGH ASPECT RATIO FEATURES
- Publication number 20080203056
- Publication date Aug 28, 2008
- JUDY WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process using polymerizing etch gases across a wafer su...
- Publication number 20070251917
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process using polymerizing etch gases and an inert dilu...
- Publication number 20070254483
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma reactor apparatus with multiple gas injection zones having t...
- Publication number 20070251642
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process using polymerizing etch gases with different et...
- Publication number 20070251918
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process with separately fed carbon-lean and carbon-rich...
- Publication number 20070254486
- Publication date Nov 1, 2007
- APPLIED MATERIALS, INC.
- Kallol Bera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch process using etch uniformity control by using composit...
- Publication number 20070249173
- Publication date Oct 25, 2007
- APPLIED MATERIALS, INC.
- Jong Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etch reactor with distribution of etch gases across a wafer...
- Publication number 20070247075
- Publication date Oct 25, 2007
- APPLIED MATERIALS, INC.
- Jong Mun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process to open carbon based hardmask
- Publication number 20070077780
- Publication date Apr 5, 2007
- Judy Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA CONTROL USING DUAL CATHODE FREQUENCY MIXING
- Publication number 20070000611
- Publication date Jan 4, 2007
- Applied Materials, Inc.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma control using dual cathode frequency mixing
- Publication number 20050090118
- Publication date Apr 28, 2005
- APPLIED MATERIALS, INC.
- Steven C. Shannon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20050003675
- Publication date Jan 6, 2005
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for shaping a magnetic field in a magnetic fie...
- Publication number 20040182516
- Publication date Sep 23, 2004
- APPLIED MATERIALS, INC.
- Roger Alan Lindley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for uniformly etching a dielectric layer
- Publication number 20040149394
- Publication date Aug 5, 2004
- APPLIED MATERIALS, INC.
- Kenny L. Doan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low loss RF bias electrode for a plasma reactor with enhanced wafer...
- Publication number 20040027781
- Publication date Feb 12, 2004
- Hiroji Hanawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Distributed inductively-coupled plasma source and circuit for coupl...
- Publication number 20030192644
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Bryan Y. Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for controlling the magnetic field intensity i...
- Publication number 20030085000
- Publication date May 8, 2003
- APPLIED MATERIALS, INC.
- Keiji Horioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flash step preparatory to dielectric etch
- Publication number 20030045116
- Publication date Mar 6, 2003
- APPLIED MATERIALS, INC.
- Zhuxu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20030037880
- Publication date Feb 27, 2003
- APPLIED MATERIALS, INC.
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dielectric etch chamber with expanded process window
- Publication number 20030038111
- Publication date Feb 27, 2003
- APPLIED MATERIALS, INC.
- James D. Carducci
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing uniform plasma in a magnetic fie...
- Publication number 20030006008
- Publication date Jan 9, 2003
- APPLIED MATERIALS, INC.
- Keiji Horioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetically enhanced plasma oxide etch using hexafluorobutadiene
- Publication number 20020173162
- Publication date Nov 21, 2002
- Jingbao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Method and apparatus for shaping a magnetic field in a magnetic fie...

Pulsed bias plasma process to control microloading

Method of controlling etch microloading for a tungsten-containing l...

Plasma reactor apparatus with multiple gas injection zones having t...

Plasma etch reactor with distribution of etch gases across a wafer...

Method and apparatus for shaping a magnetic field in a magnetic fie...

Plasma control using dual cathode frequency mixing

Halogen-free amorphous carbon mask etch having high selectivity to...

Plasma control using dual cathode frequency mixing and controlling...

Method for reducing microloading in etching high aspect ratio struc...

Plasma etch process with separately fed carbon-lean and carbon-rich...

Plasma etch process using polymerizing etch gases across a wafer su...

Process to open carbon based hardmask

Plasma etch process using polymerizing etch gases with different et...

Method and apparatus for shaping a magnetic field in a magnetic fie...

Method and apparatus for providing uniform plasma in a magnetic fie...

Apparatus for uniformly etching a dielectric layer

Method and apparatus for controlling the magnetic field intensity i...

Temperature controlled window with a fluid supply system

Monitoring dimensions of features at different locations in the pro...

Distributed inductively-coupled plasma source and circuit for coupl...

Dielectric etch chamber with expanded process window

Flash step preparatory to dielectric etch

Dielectric etch chamber with expanded process window

Shield or ring surrounding semiconductor workpiece in plasma chamber

Magnetically enhanced plasma oxide etch using hexafluorobutadiene

Distributed inductively-coupled plasma source and circuit for coupl...

Adjusting DC bias voltage in plasma chamber

Magnetically enhanced plasma etch process using a heavy fluorocarbo...

Etch method using a dielectric etch chamber with expanded process w...

Patents Applicationslast 30 patents

PULSED BIAS PLASMA PROCESS TO CONTROL MICROLOADING

METHOD OF CONTROLLING ETCH MICROLOADING FOR A TUNGSTEN-CONTAINING L...

METHOD AND APPARATUS FOR SHAPING A MAGNETIC FIELD IN A MAGNETIC FIE...

PLASMA CONTROL USING DUAL CATHODE FREQUENCY MIXING

METHOD AND APPARATUS FOR SHAPING A MAGNETIC FIELD IN A MAGNETIC FIE...

METHOD FOR REDUCING MICROLOADING IN ETCHING HIGH ASPECT RATIO STRUC...

Process to open carbon based hardmask overlying a dielectric layer

HALOGEN-FREE AMORPHOUS CARBON MASK ETCH HAVING HIGH SELECTIVITY TO...

METHODS FOR ETCHING HIGH ASPECT RATIO FEATURES

Plasma etch process using polymerizing etch gases across a wafer su...

Plasma etch process using polymerizing etch gases and an inert dilu...

Plasma reactor apparatus with multiple gas injection zones having t...

Plasma etch process using polymerizing etch gases with different et...

Plasma etch process with separately fed carbon-lean and carbon-rich...

Plasma etch process using etch uniformity control by using composit...

Plasma etch reactor with distribution of etch gases across a wafer...

Process to open carbon based hardmask

PLASMA CONTROL USING DUAL CATHODE FREQUENCY MIXING

Plasma control using dual cathode frequency mixing

Dielectric etch chamber with expanded process window

Method and apparatus for shaping a magnetic field in a magnetic fie...

Apparatus for uniformly etching a dielectric layer

Low loss RF bias electrode for a plasma reactor with enhanced wafer...

Distributed inductively-coupled plasma source and circuit for coupl...

Method and apparatus for controlling the magnetic field intensity i...

Flash step preparatory to dielectric etch

Dielectric etch chamber with expanded process window

Dielectric etch chamber with expanded process window

Method and apparatus for providing uniform plasma in a magnetic fie...

Magnetically enhanced plasma oxide etch using hexafluorobutadiene