Bryan R. Seppala

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Mahtomedi, MN, US

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Patents Grantslast 30 patents

Information Patent Grant
Getter on die in an upper sense plate designed system
- Patent number 7,800,190
- Issue date Sep 21, 2010
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for sealing a MEMS device
- Patent number 7,736,946
- Issue date Jun 15, 2010
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
- Publication number 20110227173
- Publication date Sep 22, 2011
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS
- Publication number 20100020517
- Publication date Jan 28, 2010
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER ON DIE IN AN UPPER SENSE PLATE DESIGNED SYSTEM
- Publication number 20090309203
- Publication date Dec 17, 2009
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AUTOMATED PREFORM ATTACH FOR VACUUM PACKAGING
- Publication number 20090014499
- Publication date Jan 15, 2009
- Honeywell International Inc.
- Bryan R. Seppala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SEALING A MEMS DEVICE
- Publication number 20080188035
- Publication date Aug 7, 2008
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY