Membership
Tour
Register
Log in
Budi Njoman
Follow
Person
Singapore, SG
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package and a method for dissipating heat in an...
Patent number
8,859,333
Issue date
Oct 14, 2014
LSI Corporation
Kok Hua Simon Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High thermal performance packaging for circuit dies
Patent number
7,776,648
Issue date
Aug 17, 2010
Agere Systems Inc.
Kok Hua Chua
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND A METHOD FOR DISSIPATING HEAT IN AN...
Publication number
20100120206
Publication date
May 13, 2010
Agere Systems, Inc.
Kok Hua Chua
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
High Thermal Performance Packaging for Circuit Dies
Publication number
20090001561
Publication date
Jan 1, 2009
Kok Hua Chua
H01 - BASIC ELECTRIC ELEMENTS