BumRyul MAENG

Person

Incheon, KR

People

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY
- Publication number 20250226288
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OMNIDIRECTIONAL SENSOR PACKAGE AND A METHOD FOR MAKING THE SAME
- Publication number 20250228032
- Publication date Jul 10, 2025
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME
- Publication number 20240421138
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240421172
- Publication date Dec 19, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240405049
- Publication date Dec 5, 2024
- STATS ChipPAC Pte Ltd.
- BumRyul MAENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240387400
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME
- Publication number 20240387577
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- HyunKyu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND A PACKAGING METHOD
- Publication number 20240371812
- Publication date Nov 7, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240363368
- Publication date Oct 31, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME
- Publication number 20240096920
- Publication date Mar 21, 2024
- STATS ChipPAC Pte Ltd.
- MyungHo JUNG
- H01 - BASIC ELECTRIC ELEMENTS

BumRyul MAENG

Person

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE ASSEMBLY WITH AN INTERLAYER COOLING PATHWAY

OMNIDIRECTIONAL SENSOR PACKAGE AND A METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME

TWO-WAY OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

OPTICAL SENSOR PACKAGE AND A METHOD FOR FORMING THE SAME

ELECTRONIC PACKAGE AND A PACKAGING METHOD

SENSOR PACKAGE AND METHOD FOR FORMING THE SAME

SENSOR ASSEMBLY AND METHOD FOR FORMING THE SAME