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Bun-Hin Keong
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Muar Johor, MY
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Patents Grants
last 30 patents
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Patent Grant
Chip-sized flip-chip semiconductor package and method for making th...
Patent number
7,615,410
Issue date
Nov 10, 2009
Infineon Technologies AG
Koh Hoo Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadframe for use in a semiconductor package
Patent number
7,432,584
Issue date
Oct 7, 2008
Infineon Technologies, AG
Koh Hoo Goh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Chip-Sized Flip-Chip Semiconductor Package and Method for Making th...
Publication number
20070029666
Publication date
Feb 8, 2007
Koh Hoo Goh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Leadframe for use in a semiconductor package
Publication number
20050077598
Publication date
Apr 14, 2005
Koh Hoo Goh
H01 - BASIC ELECTRIC ELEMENTS