Bun Kian Tay

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 11,515,244
- Issue date Nov 29, 2022
- Infineon Technologies AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated leadless package having an at least partially exposed...
- Patent number 10,978,378
- Issue date Apr 13, 2021
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clip frame assembly, semiconductor package having a lead frame and...
- Patent number 10,964,628
- Issue date Mar 30, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20230051100
- Publication date Feb 16, 2023
- INFINEON TECHNOLOGIES AG
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME
- Publication number 20210166998
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273790
- Publication date Aug 27, 2020
- Bun Kian Tay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Clip Frame Assembly, Semiconductor Package Having a Lead Frame and...
- Publication number 20200273781
- Publication date Aug 27, 2020
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Leadless Package Having an at Least Partially Exposed...
- Publication number 20190189542
- Publication date Jun 20, 2019
- INFINEON TECHNOLOGIES AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS