Bunsuke OGAWA

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead solder joint structure and manufacturing method thereof
- Patent number 9,877,399
- Issue date Jan 23, 2018
- NEC SPACE TECHNOLOGIES, LTD.
- Bunsuke Ogawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD SOLDER JOINT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170079147
- Publication date Mar 16, 2017
- NEC Space Technologies, Ltd,
- Bunsuke OGAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR