Byeongdeck Jang

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 12,198,990
- Issue date Jan 14, 2025
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,854,891
- Issue date Dec 26, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,115
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,764,114
- Issue date Sep 19, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer manufacturing method and laminated device chip manufacturing...
- Patent number 11,756,831
- Issue date Sep 12, 2023
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece cutting method
- Patent number 11,682,569
- Issue date Jun 20, 2023
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing workpiece and resin sheet unit
- Patent number 11,590,629
- Issue date Feb 28, 2023
- Disco Corporation
- Yosuke Murata
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing workpiece and resin sheet unit
- Patent number 11,508,607
- Issue date Nov 22, 2022
- Disco Corporation
- Yosuke Murata
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of producing shielded individual semiconductor...
- Patent number 11,322,476
- Issue date May 3, 2022
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece processing method
- Patent number 11,289,348
- Issue date Mar 29, 2022
- Disco Corporation
- Byeongdeck Jang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate processing method and protective tape
- Patent number 11,183,464
- Issue date Nov 23, 2021
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing packaged device chip
- Patent number 11,133,198
- Issue date Sep 28, 2021
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plate-shaped workpiece processing method
- Patent number 11,114,385
- Issue date Sep 7, 2021
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method
- Patent number 10,937,668
- Issue date Mar 2, 2021
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for package substrate
- Patent number 10,861,716
- Issue date Dec 8, 2020
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dividing substrate along division lines using abrasive m...
- Patent number 10,515,841
- Issue date Dec 24, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor package including a shield...
- Patent number 10,497,623
- Issue date Dec 3, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package
- Patent number 10,431,555
- Issue date Oct 1, 2019
- Disco Corporation
- Byeongdeck Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-blade and processing method of workpiece
- Patent number 10,403,520
- Issue date Sep 3, 2019
- Disco Corporation
- Byeongdeck Jang
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 10,366,907
- Issue date Jul 30, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package manufacturing method
- Patent number 10,211,164
- Issue date Feb 19, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157660
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157668
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157669
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157658
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157659
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...
- Publication number 20220157667
- Publication date May 19, 2022
- Disco Corporation
- Youngsuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE CUTTING METHOD
- Publication number 20210074559
- Publication date Mar 11, 2021
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING PACKAGED DEVICE CHIP
- Publication number 20200343108
- Publication date Oct 29, 2020
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT
- Publication number 20200180101
- Publication date Jun 11, 2020
- Disco Corporation
- Yosuke MURATA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT
- Publication number 20200185255
- Publication date Jun 11, 2020
- Disco Corporation
- Yosuke MURATA
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE PROCESSING METHOD
- Publication number 20200161151
- Publication date May 21, 2020
- Disco Corporation
- Byeongdeck JANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20200105715
- Publication date Apr 2, 2020
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20190295859
- Publication date Sep 26, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING METHOD FOR PACKAGE SUBSTRATE
- Publication number 20190279883
- Publication date Sep 12, 2019
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE PROCESSING METHOD AND PROTECTIVE TAPE
- Publication number 20190109094
- Publication date Apr 11, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-BLADE AND PROCESSING METHOD OF WORKPIECE
- Publication number 20190067050
- Publication date Feb 28, 2019
- Disco Corporation
- Byeongdeck Jang
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20190006290
- Publication date Jan 3, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20190006198
- Publication date Jan 3, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20190006224
- Publication date Jan 3, 2019
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20180308756
- Publication date Oct 25, 2018
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20180211926
- Publication date Jul 26, 2018
- Disco Corporation
- Byeongdeck Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE MANUFACTURING METHOD
- Publication number 20180182715
- Publication date Jun 28, 2018
- Disco Corporation
- Youngsuk Kim
- H01 - BASIC ELECTRIC ELEMENTS

Byeongdeck Jang

Person

Patents Grantslast 30 patents

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Wafer manufacturing method and laminated device chip manufacturing...

Workpiece cutting method

Method of processing workpiece and resin sheet unit

Method of processing workpiece and resin sheet unit

Manufacturing method of producing shielded individual semiconductor...

Workpiece processing method

Package substrate processing method and protective tape

Method of manufacturing packaged device chip

Plate-shaped workpiece processing method

Semiconductor package manufacturing method

Processing method for package substrate

Method for dividing substrate along division lines using abrasive m...

Method of manufacturing a semiconductor package including a shield...

Method of manufacturing semiconductor package

Multi-blade and processing method of workpiece

Manufacturing method of semiconductor package

Semiconductor package manufacturing method

Patents Applicationslast 30 patents

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WAFER MANUFACTURING METHOD AND LAMINATED DEVICE CHIP MANUFACTURING...

WORKPIECE CUTTING METHOD

METHOD OF MANUFACTURING PACKAGED DEVICE CHIP

METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT

METHOD OF PROCESSING WORKPIECE AND RESIN SHEET UNIT

WORKPIECE PROCESSING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

PROCESSING METHOD FOR PACKAGE SUBSTRATE

PACKAGE SUBSTRATE PROCESSING METHOD AND PROTECTIVE TAPE

MULTI-BLADE AND PROCESSING METHOD OF WORKPIECE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURING METHOD

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

SUBSTRATE PROCESSING METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE MANUFACTURING METHOD