Byeongkeol KIM

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device including thermosetting bonding sheet
- Patent number 12,144,115
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board for transmitting signal in high-frequency ban...
- Patent number 11,617,257
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flexible printed circuit board and electronic device includin...
- Patent number 11,564,311
- Issue date Jan 24, 2023
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having copper clad laminate laminated on core layer,...
- Patent number 11,510,312
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230354511
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET
- Publication number 20230119170
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAN...
- Publication number 20220322522
- Publication date Oct 6, 2022
- Samsung Electronics Co., LTD
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISI...
- Publication number 20220151070
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...
- Publication number 20210251071
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING COPPER CLAD LAMINATE LAMINATED ON CORE LAYER,...
- Publication number 20210168934
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H01 - BASIC ELECTRIC ELEMENTS

Byeongkeol KIM

Person

Patents Grantslast 30 patents

Electronic device including thermosetting bonding sheet

Printed circuit board for transmitting signal in high-frequency ban...

Rigid-flexible printed circuit board and electronic device includin...

Circuit board having copper clad laminate laminated on core layer,...

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET

PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAN...

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISI...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...

CIRCUIT BOARD HAVING COPPER CLAD LAMINATE LAMINATED ON CORE LAYER,...