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Byeongtak PARK

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  • Suwon-si, KR
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Patents Applicationslast 30 patents

  • Information Patent Application

    APPARATUS FOR MEASURING AN ADHESION FORCE
    • Publication number 20240234215
    • Publication date Jul 11, 2024
    • Samsung Electronics Co., Ltd.
    • Donggap SHIN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE BONDING APPARATUS
    • Publication number 20240153906
    • Publication date May 9, 2024
    • Samsung Electronics Co., Ltd.
    • Byeongtak PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    APPARATUS FOR MEASURING AN ADHESION FORCE
    • Publication number 20240136231
    • Publication date Apr 25, 2024
    • Samsung Electronics Co., Ltd.
    • Donggap SHIN
    • H01 - BASIC ELECTRIC ELEMENTS