Byeung Chul Kim

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of forming integrated assemblies with improved charge migra...
- Patent number 12,156,406
- Issue date Nov 26, 2024
- Byeung Chul Kim
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 12,150,303
- Issue date Nov 19, 2024
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 12,082,416
- Issue date Sep 3, 2024
- Micron Technology, Inc.
- Byeung Chul Kim
Information Patent Grant
Microelectronic devices including stack structures having air gaps,...
- Patent number 12,052,862
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices comprising adjoining oxide materials and related...
- Patent number 11,672,118
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 11,672,120
- Issue date Jun 6, 2023
- Micron Technology, Inc.
- Byeung Chui Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having vertically-extending channel material...
- Patent number 11,631,697
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,587,948
- Issue date Feb 21, 2023
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,557,608
- Issue date Jan 17, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-extending channel material...
- Patent number 11,289,501
- Issue date Mar 29, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having improved charge migration
- Patent number 11,171,153
- Issue date Nov 9, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,107,830
- Issue date Aug 31, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having vertically-spaced channel material seg...
- Patent number 11,081,497
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 11,037,956
- Issue date Jun 15, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry comprising an array, method of forming an arra...
- Patent number 10,943,907
- Issue date Mar 9, 2021
- Micron Technology, Inc.
- Cornel Bozdog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming an apparatus for making semiconductor dieves
- Patent number 10,930,548
- Issue date Feb 23, 2021
- Micron Technology, Inc.
- Shane J. Trapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having charge-trapping material arranged in v...
- Patent number 10,777,576
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Method used in forming integrated circuitry
- Patent number 10,770,465
- Issue date Sep 8, 2020
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuitry comprising an array, method of forming an arra...
- Patent number 10,707,211
- Issue date Jul 7, 2020
- Micron Technology, Inc.
- Cornel Bozdog
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20240381646
- Publication date Nov 14, 2024
- Micron Technology, Inc.
- Byeung Chul Kim
Information Patent Application
Memory Circuitry And Method Used In Forming Memory Circuitry
- Publication number 20240268116
- Publication date Aug 8, 2024
- Micron Technology, Inc.
- Amiya Banerjee
Information Patent Application
ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...
- Publication number 20240130124
- Publication date Apr 18, 2024
- Micron Technology, Inc.
- Shyam Surthi
Information Patent Application
MERGED CAVITIES AND BURIED ETCH STOPS FOR THREE-DIMENSIONAL MEMORY...
- Publication number 20230397422
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CAVITY MERGING FOR ISOLATION REGIONS IN A MEMORY DIE
- Publication number 20230395422
- Publication date Dec 7, 2023
- Micron Technology, Inc.
- Yoshiaki Fukuzumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES COMPRISING SEGMENTED HIGH-K DIELECTRIC MATERIALS...
- Publication number 20230389311
- Publication date Nov 30, 2023
- Micron Technology, Inc.
- Yifen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...
- Publication number 20230345722
- Publication date Oct 26, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Charge-Trapping Material Arranged in V...
- Publication number 20230262981
- Publication date Aug 17, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING AIR GAPS,...
- Publication number 20230189515
- Publication date Jun 15, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20230034157
- Publication date Feb 2, 2023
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Extending Channel Material...
- Publication number 20220173123
- Publication date Jun 2, 2022
- Micron Technology, Inc.
- Shyam Surthi
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...
- Publication number 20220077176
- Publication date Mar 10, 2022
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220037357
- Publication date Feb 3, 2022
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20210366927
- Publication date Nov 25, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20210335817
- Publication date Oct 28, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Charge-Trapping Material Arranged in V...
- Publication number 20210327898
- Publication date Oct 21, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20210143171
- Publication date May 13, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20210057436
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Spaced Channel Material Seg...
- Publication number 20210057434
- Publication date Feb 25, 2021
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Vertically-Extending Channel Material...
- Publication number 20200373322
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Shyam Surthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Charge-Trapping Material Arranged in V...
- Publication number 20200373325
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Byeung Chul Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Charge-Trapping Material Arranged in V...
- Publication number 20200321351
- Publication date Oct 8, 2020
- Micron Technology, Inc.
- Byeung Chul Kim
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Circuitry Comprising An Array, Method Of Forming An Arra...
- Publication number 20200266197
- Publication date Aug 20, 2020
- Micron Technology, Inc.
- Cornel Bozdog
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN APPARATUS, AND RELATED APPARATUSES AND ELECTR...
- Publication number 20200235004
- Publication date Jul 23, 2020
- Micron Technology, Inc.
- Shane J. Trapp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuitry Comprising An Array, Method Of Forming An Arra...
- Publication number 20200098761
- Publication date Mar 26, 2020
- Micron Technology, Inc.
- Cornel Bozdog
- H01 - BASIC ELECTRIC ELEMENTS

Byeung Chul Kim

Person

Patents Grantslast 30 patents

Methods of forming integrated assemblies with improved charge migra...

Integrated assemblies having charge-trapping material arranged in v...

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including stack structures having air gaps,...

Electronic devices comprising adjoining oxide materials and related...

Integrated assemblies having charge-trapping material arranged in v...

Integrated assemblies having vertically-extending channel material...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-extending channel material...

Integrated assemblies having improved charge migration

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having vertically-spaced channel material seg...

Integrated assemblies having charge-trapping material arranged in v...

Integrated circuitry comprising an array, method of forming an arra...

Methods of forming an apparatus for making semiconductor dieves

Integrated assemblies having charge-trapping material arranged in v...

Method used in forming integrated circuitry

Integrated circuitry comprising an array, method of forming an arra...

Patents Applicationslast 30 patents

Integrated Assemblies and Methods of Forming Integrated Assemblies

Memory Circuitry And Method Used In Forming Memory Circuitry

ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...

MERGED CAVITIES AND BURIED ETCH STOPS FOR THREE-DIMENSIONAL MEMORY...

SELECTIVE CAVITY MERGING FOR ISOLATION REGIONS IN A MEMORY DIE

ELECTRONIC DEVICES COMPRISING SEGMENTED HIGH-K DIELECTRIC MATERIALS...

MEMORY APPARATUS AND METHODS INCLUDING MERGED PROCESS FOR MEMORY CE...

Integrated Assemblies Having Charge-Trapping Material Arranged in V...

MICROELECTRONIC DEVICES INCLUDING STACK STRUCTURES HAVING AIR GAPS,...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies Having Vertically-Extending Channel Material...

ELECTRONIC DEVICES COMPRISING ADJOINING OXIDE MATERIALS AND RELATED...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies Having Charge-Trapping Material Arranged in V...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies Having Vertically-Spaced Channel Material Seg...

Integrated Assemblies Having Vertically-Extending Channel Material...

Integrated Assemblies Having Charge-Trapping Material Arranged in V...

Integrated Assemblies Having Charge-Trapping Material Arranged in V...

Integrated Circuitry Comprising An Array, Method Of Forming An Arra...

METHODS OF FORMING AN APPARATUS, AND RELATED APPARATUSES AND ELECTR...

Integrated Circuitry Comprising An Array, Method Of Forming An Arra...