Byeung Ho KIM

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Chungcheongbuk-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a substrate for a semiconductor package
- Patent number 8,298,865
- Issue date Oct 30, 2012
- Hynix Semiconductor Inc.
- Young Berm Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor package
- Patent number 8,125,086
- Issue date Feb 28, 2012
- Hynix Semiconductor Inc.
- Young Berm Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE S...
- Publication number 20120118495
- Publication date May 17, 2012
- Hynix Semiconductor Inc.
- Young Berm JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE S...
- Publication number 20090294972
- Publication date Dec 3, 2009
- Young Berm JUNG
- H01 - BASIC ELECTRIC ELEMENTS