Byoung-Gi Jang

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,133,296
- Issue date Sep 28, 2021
- Samsung Electronics Co., Ltd.
- Chanhee Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Degradation compensation device and organic light emitting display...
- Patent number 10,867,551
- Issue date Dec 15, 2020
- Samsung Electronics Co., Ltd.
- Ji Heon Ok
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package
- Patent number 10,622,340
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Chanhee Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of manufacturing same
- Patent number 10,510,672
- Issue date Dec 17, 2019
- Samsung Electronics Co., Ltd.
- Sang-Uk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing the same
- Patent number 9,899,487
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Myeong-Dong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates and integrated circuit packages including the same
- Patent number 9,370,098
- Issue date Jun 14, 2016
- Samsung Electronics Co., Ltd.
- Byoung Wook Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package stack structure having interposer substrate
- Patent number 9,349,713
- Issue date May 24, 2016
- Samsung Electronics Co., Ltd.
- Jong-Kook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for registration of mobile station to compact...
- Patent number 8,989,711
- Issue date Mar 24, 2015
- Samsung Electronics Co., Ltd.
- Byoung-Gi Jang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package system with leads having multiple sides...
- Patent number 8,847,413
- Issue date Sep 30, 2014
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with stacked die
- Patent number 8,810,019
- Issue date Aug 19, 2014
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for ranging in broadband wireless access commu...
- Patent number 8,634,378
- Issue date Jan 21, 2014
- Samsung Electronics Co., Ltd.
- Hyon-Goo Kang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Apparatus and method for handover optimization in broadband wireles...
- Patent number 8,576,797
- Issue date Nov 5, 2013
- Samsung Electronics Co., Ltd.
- Byoung-Gi Jang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for manufacture of inline integrated circuit system
- Patent number 8,501,540
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for transmitting load indicator in a broadband...
- Patent number 8,503,395
- Issue date Aug 6, 2013
- Samsung Electronics Co., Ltd.
- Sung-Hyun Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit packaging system with lead frame stacking module...
- Patent number 8,481,420
- Issue date Jul 9, 2013
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stacked configuration and...
- Patent number 8,405,197
- Issue date Mar 26, 2013
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for allocating preamble index of self configur...
- Patent number 8,160,646
- Issue date Apr 17, 2012
- Samsung Electronics Co., Ltd.
- Byoung-Gi Jang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated circuit package system with stacked die
- Patent number 8,138,591
- Issue date Mar 20, 2012
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having an internal structure pr...
- Patent number 7,994,625
- Issue date Aug 9, 2011
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inline integrated circuit system
- Patent number 7,968,981
- Issue date Jun 28, 2011
- Stats Chippac Ltd.
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system with intra-stack encapsul...
- Patent number 7,871,861
- Issue date Jan 18, 2011
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with wire bond pattern
- Patent number 7,863,737
- Issue date Jan 4, 2011
- Stats Chippac Ltd.
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing structural support
- Patent number 7,683,467
- Issue date Mar 23, 2010
- Stats Chippac Ltd.
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20240357799
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choong Hyun LEE
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200098734
- Publication date Mar 26, 2020
- Samsung Electronics Co., Ltd.
- CHANHEE JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEGRADATION COMPENSATION DEVICE AND ORGANIC LIGHT EMITTING DISPLAY...
- Publication number 20200058249
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- Ji Heon OK
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SAME
- Publication number 20190019758
- Publication date Jan 17, 2019
- Samsung Electronics Co., Ltd.
- Sang-Uk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20180145061
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- CHANHEE JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20170263723
- Publication date Sep 14, 2017
- Samsung Electronics Co., Ltd.
- Myeong-Dong LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STACK STRUCTURE HAVING INTERPOSER SUBSTRATE
- Publication number 20160027764
- Publication date Jan 28, 2016
- Jong-Kook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES AND INTEGRATED CIRCUIT PACKAGES INCLUDING THE SAME
- Publication number 20150189750
- Publication date Jul 2, 2015
- Byoung Wook JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME
- Publication number 20150155216
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- JONGKOOK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME STACKING MODULE...
- Publication number 20120235307
- Publication date Sep 20, 2012
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE
- Publication number 20120133038
- Publication date May 31, 2012
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM
- Publication number 20110244635
- Publication date Oct 6, 2011
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...
- Publication number 20110062599
- Publication date Mar 17, 2011
- Joon Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for handover optimization in broadband wireles...
- Publication number 20110044285
- Publication date Feb 24, 2011
- Samsung Electronics Co., Ltd.
- Byoung-Gi Jang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHOD FOR TRANSMITTING LOAD INDICATOR IN A BROADBAND...
- Publication number 20100254279
- Publication date Oct 7, 2010
- Samsung Electronics Co. Ltd.
- Sung-Hyun CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED CONFIGURATION AND...
- Publication number 20100244217
- Publication date Sep 30, 2010
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for ranging in Broadband wireless access commu...
- Publication number 20100202282
- Publication date Aug 12, 2010
- Samsung Electronics Co., Ltd.
- Hyon-Goo Kang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PR...
- Publication number 20100123232
- Publication date May 20, 2010
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for allocating preamble index of self configur...
- Publication number 20100040000
- Publication date Feb 18, 2010
- Samsung Electronics Co., Ltd.
- Byoung-Gi Jang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHOD FOR DETERMINING A POSITION OF A COMPACT BASE S...
- Publication number 20090325592
- Publication date Dec 31, 2009
- Samsung Electronics Co. Ltd.
- Byoung-Gi JANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSUL...
- Publication number 20090321908
- Publication date Dec 31, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20090283889
- Publication date Nov 19, 2009
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INLINE INTEGRATED CIRCUIT SYSTEM
- Publication number 20090258494
- Publication date Oct 15, 2009
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR REGISTRATION OF MOBILE STATION TO COMPACT...
- Publication number 20080293420
- Publication date Nov 27, 2008
- Samsung Electronics Co. Ltd.
- Byoung-Gi JANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS HAVING MULTIPLE SIDES...
- Publication number 20080171405
- Publication date Jul 17, 2008
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package system employing structural support
- Publication number 20080135989
- Publication date Jun 12, 2008
- STATS ChipPAC Ltd.
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE
- Publication number 20080073770
- Publication date Mar 27, 2008
- Jae Hak Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE BOND PATTERN
- Publication number 20070235869
- Publication date Oct 11, 2007
- STATS ChipPAC Ltd.
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS

Byoung-Gi Jang

Person

Patents Grantslast 30 patents

Semiconductor package

Degradation compensation device and organic light emitting display...

Semiconductor package

Semiconductor packages and methods of manufacturing same

Semiconductor devices and methods of manufacturing the same

Package substrates and integrated circuit packages including the same

Semiconductor package stack structure having interposer substrate

Apparatus and method for registration of mobile station to compact...

Integrated circuit package system with leads having multiple sides...

Integrated circuit package system with stacked die

Method and apparatus for ranging in broadband wireless access commu...

Apparatus and method for handover optimization in broadband wireles...

Method for manufacture of inline integrated circuit system

Apparatus and method for transmitting load indicator in a broadband...

Integrated circuit packaging system with lead frame stacking module...

Integrated circuit packaging system with stacked configuration and...

Apparatus and method for allocating preamble index of self configur...

Integrated circuit package system with stacked die

Integrated circuit packaging system having an internal structure pr...

Inline integrated circuit system

Stacked integrated circuit package system with intra-stack encapsul...

Integrated circuit package system with wire bond pattern

Integrated circuit package system employing structural support

Patents Applicationslast 30 patents

SEMICONDUCTOR MEMORY DEVICE

SEMICONDUCTOR PACKAGE

DEGRADATION COMPENSATION DEVICE AND ORGANIC LIGHT EMITTING DISPLAY...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STACK STRUCTURE HAVING INTERPOSER SUBSTRATE

PACKAGE SUBSTRATES AND INTEGRATED CIRCUIT PACKAGES INCLUDING THE SAME

SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME STACKING MODULE...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE

METHOD FOR MANUFACTURE OF INLINE INTEGRATED CIRCUIT SYSTEM

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...

Apparatus and method for handover optimization in broadband wireles...

APPARATUS AND METHOD FOR TRANSMITTING LOAD INDICATOR IN A BROADBAND...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED CONFIGURATION AND...

Method and apparatus for ranging in Broadband wireless access commu...

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PR...

Apparatus and method for allocating preamble index of self configur...

APPARATUS AND METHOD FOR DETERMINING A POSITION OF A COMPACT BASE S...

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSUL...

INTEGRATED CIRCUIT PACKAGE SYSTEM

INLINE INTEGRATED CIRCUIT SYSTEM

APPARATUS AND METHOD FOR REGISTRATION OF MOBILE STATION TO COMPACT...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS HAVING MULTIPLE SIDES...

Integrated circuit package system employing structural support

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKED DIE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WIRE BOND PATTERN