Byoung-Gu CliO

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Seongnam-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
ROUND CHIP SCALE PACKAGE AND MANUFACTURING METHOD THEREFOR
- Publication number 20190259921
- Publication date Aug 22, 2019
- Lightizer Korea Co., Ltd
- Jae-Sik MIN
- H01 - BASIC ELECTRIC ELEMENTS