Byoung-jun Min

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Ahsan-city, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor test apparatus
- Patent number 10,120,016
- Issue date Nov 6, 2018
- Samsung Electronics Co., Ltd.
- Dong-young Lee
- G01 - MEASURING TESTING
Information Patent Grant
Test socket, and test apparatus with test socket to control a tempe...
- Patent number 8,564,317
- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Jong-Won Han
- G01 - MEASURING TESTING
Information Patent Grant
Test kit for semiconductor package and method for testing semicondu...
- Patent number 7,017,428
- Issue date Mar 28, 2006
- Samsung Electronics Co., Ltd.
- Byoung-jun Min
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor package testing equipment including loader having pac...
- Patent number 6,462,534
- Issue date Oct 8, 2002
- Samsung Electronics Co., Ltd.
- Seong-goo Kang
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR TEST APPARATUS
- Publication number 20170102427
- Publication date Apr 13, 2017
- Samsung Electronics Co., Ltd.
- Dong-young LEE
- G01 - MEASURING TESTING
Information Patent Application
CONTACT STRUCTURE FOR A TEST HANDLER, TEST HANDLER HAVING THE CONTA...
- Publication number 20160061884
- Publication date Mar 3, 2016
- Samsung Electronics Co., Ltd.
- Jung-Hyun CHO
- G01 - MEASURING TESTING
Information Patent Application
Integrated monitoring burn-in test method for multi-chip package
- Publication number 20040145387
- Publication date Jul 29, 2004
- Geum-Jin Yun
- G01 - MEASURING TESTING
Information Patent Application
Test kit for semiconductor package and method for testing semicondu...
- Publication number 20040112142
- Publication date Jun 17, 2004
- Byoung-Jun Min
- G01 - MEASURING TESTING
Information Patent Application
SOCKET, CIRCUIT BOARD, AND SUB-CIRCUIT BOARD FOR SEMICONDUCTOR INTE...
- Publication number 20020037672
- Publication date Mar 28, 2002
- BYOUNG JUN MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package testing equipment including loader having pac...
- Publication number 20010026152
- Publication date Oct 4, 2001
- Seong-goo Kang
- G01 - MEASURING TESTING