Byoung-Yoon Seo

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with electromagnetic shielding member
- Patent number 9,837,361
- Issue date Dec 5, 2017
- Samsung Electronics Co., Ltd.
- Byoung-rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package
- Patent number 9,793,309
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Byoung-rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a blocking pattern between a light tra...
- Patent number 8,981,514
- Issue date Mar 17, 2015
- Samsung Electronics Co., Ltd.
- Han-Sung Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and method of manufacturing the camera module
- Patent number 8,927,316
- Issue date Jan 6, 2015
- Samsung Electronics Co., Ltd.
- Yong-Hoe Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module having image sensor package
- Patent number 8,902,356
- Issue date Dec 2, 2014
- Samsung Electronics Co., Ltd.
- Byoung-Rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Camera module and method of manufacturing the camera module
- Patent number 8,547,471
- Issue date Oct 1, 2013
- Samsung Electronics Co., Ltd.
- Yong-Hoe Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Camera module
- Patent number 8,139,145
- Issue date Mar 20, 2012
- Samsung Electronics Co., Ltd.
- Han-Sung Ryu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor package and method of manufacturing the same
- Patent number 7,863,702
- Issue date Jan 4, 2011
- Samsung Electronics Co., Ltd.
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module structure comprising wire bonding package and m...
- Patent number 7,494,292
- Issue date Feb 24, 2009
- Samsung Electronics Co., Ltd.
- Yung-Cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor camera module and method of fabricating the same
- Patent number 7,484,901
- Issue date Feb 3, 2009
- Samsung Electronics Co., Ltd.
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of fabricating metal wiring in semiconductor devices
- Patent number 7,300,879
- Issue date Nov 27, 2007
- Dongbu Electronics Co., Ltd.
- Byoung-Yoon Seo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR DETERMINING STATUS OF A ROBOT
- Publication number 20210387339
- Publication date Dec 16, 2021
- SKC solmics Co., Ltd.
- Nam In KIM
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF AN END EFFECTOR
- Publication number 20210391196
- Publication date Dec 16, 2021
- SKC solmics Co., Ltd.
- Nam In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160111376
- Publication date Apr 21, 2016
- Samsung Electronics Co., Ltd.
- Byoung-rim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE
- Publication number 20150340397
- Publication date Nov 26, 2015
- FUREX CO., LTD.
- Byoung-rim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE
- Publication number 20140073079
- Publication date Mar 13, 2014
- Yong-Hoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130181314
- Publication date Jul 18, 2013
- Han-Sung RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE
- Publication number 20110285889
- Publication date Nov 24, 2011
- Samsung Electronics Co., Ltd.
- Yong-Hoe Cho
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE SENSOR MODULE HAVING IMAGE SENSOR PACKAGE
- Publication number 20110267535
- Publication date Nov 3, 2011
- Byoung-Rim Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAMERA MODULE
- Publication number 20090115891
- Publication date May 7, 2009
- Samsung Electronics Co., Ltd.
- Han-Sung RYU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor camera module and method of fabricating the same
- Publication number 20060028573
- Publication date Feb 9, 2006
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor package and method of manufacturing the same
- Publication number 20060006486
- Publication date Jan 12, 2006
- Byoung-Rim Seo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Image sensor module structure comprising wire bonding package and m...
- Publication number 20050285016
- Publication date Dec 29, 2005
- Yung-Cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package, image sensor module including chip package, and manuf...
- Publication number 20050258502
- Publication date Nov 24, 2005
- Yung-Cheol Kong
- H01 - BASIC ELECTRIC ELEMENTS

Byoung-Yoon Seo

Person

Patents Grantslast 30 patents

Semiconductor package with electromagnetic shielding member

Image sensor package

Semiconductor package having a blocking pattern between a light tra...

Camera module and method of manufacturing the camera module

Image sensor module having image sensor package

Camera module and method of manufacturing the camera module

Camera module

Image sensor package and method of manufacturing the same

Image sensor module structure comprising wire bonding package and m...

Image sensor camera module and method of fabricating the same

Methods of fabricating metal wiring in semiconductor devices

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR DETERMINING STATUS OF A ROBOT

METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF AN END EFFECTOR

SEMICONDUCTOR PACKAGE

IMAGE SENSOR PACKAGE

CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

CAMERA MODULE AND METHOD OF MANUFACTURING THE CAMERA MODULE

IMAGE SENSOR MODULE HAVING IMAGE SENSOR PACKAGE

CAMERA MODULE

Image sensor camera module and method of fabricating the same

Image sensor package and method of manufacturing the same

Image sensor module structure comprising wire bonding package and m...

Chip package, image sensor module including chip package, and manuf...