Byoung Youp Kim

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Schenectady, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming a pattern for interconnection lines and associate...
- Patent number 9,818,623
- Issue date Nov 14, 2017
- GLOBALFOUNDRIES Inc.
- Jason Eugene Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure for semiconductor devices with multiple powe...
- Patent number 9,812,396
- Issue date Nov 7, 2017
- GLOBALFOUNDRIES Inc.
- Jason Eugene Stephens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming ANA regions in an integrated circuit
- Patent number 9,786,545
- Issue date Oct 10, 2017
- GLOBALFOUNDRIES Inc.
- Guillaume Bouche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure in an integrated circuit for damage prevention...
- Patent number 9,646,939
- Issue date May 9, 2017
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer structure in an integrated circuit for damage prevention...
- Patent number 9,337,087
- Issue date May 10, 2016
- STMicroelectronics, Inc.
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A PATTERN FOR INTERCONNECTION LINES AND ASSOCIATE...
- Publication number 20170278720
- Publication date Sep 28, 2017
- GLOBALFOUNDRIES INC.
- Jason Eugene STEPHENS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER STRUCTURE IN AN INTEGRATED CIRCUIT FOR DAMAGE PREVENTION...
- Publication number 20160218070
- Publication date Jul 28, 2016
- International Business Machines Corporation
- John H. Zhang
- H01 - BASIC ELECTRIC ELEMENTS