ByoungOk LEE

Person

Bucheon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit direct cooling systems having substrates in cont...
- Patent number 11,967,540
- Issue date Apr 23, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a spacer with a junction cooling pipe
- Patent number 11,201,105
- Issue date Dec 14, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices
- Patent number 11,031,379
- Issue date Jun 8, 2021
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having junction cooling pipes embedded in sub...
- Patent number 10,607,919
- Issue date Mar 31, 2020
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stray inductance reduction in packaged semiconductor devices and mo...
- Patent number 10,090,279
- Issue date Oct 2, 2018
- Semiconductor Components Industries, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20240234246
- Publication date Jul 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20240186211
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE
- Publication number 20240162110
- Publication date May 16, 2024
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20220157688
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20220093487
- Publication date Mar 24, 2022
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20210066256
- Publication date Mar 4, 2021
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20200185305
- Publication date Jun 11, 2020
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS
- Publication number 20180315681
- Publication date Nov 1, 2018
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MO...
- Publication number 20180254262
- Publication date Sep 6, 2018
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS

ByoungOk LEE

Person

Patents Grantslast 30 patents

Integrated circuit direct cooling systems having substrates in cont...

Semiconductor package having a spacer with a junction cooling pipe

Stray inductance reduction in packaged semiconductor devices

Semiconductor package having junction cooling pipes embedded in sub...

Stray inductance reduction in packaged semiconductor devices and mo...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES

SEMICONDUCTOR DEVICE PACKAGE ASSEMBLIES AND METHODS OF MANUFACTURE

DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS

STRAY INDUCTANCE REDUCTION IN PACKAGED SEMICONDUCTOR DEVICES AND MO...