ByoungWoo Cho

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 11,410,935
- Issue date Aug 9, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package using cavity substrate and manufacturing methods
- Patent number 10,672,715
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20220375807
- Publication date Nov 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20200303315
- Publication date Sep 24, 2020
- Amkor Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
- Publication number 20190318994
- Publication date Oct 17, 2019
- Amkor Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS