ByoungWook Jang

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Kyonggi-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming mold underfill using dis...
- Patent number 8,785,251
- Issue date Jul 22, 2014
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming mold underfill using dis...
- Patent number 8,569,895
- Issue date Oct 29, 2013
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming mold underfill using dis...
- Patent number 8,193,036
- Issue date Jun 5, 2012
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Mold Underfill Using Dis...
- Publication number 20140004659
- Publication date Jan 2, 2014
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Mold Underfill Using Dis...
- Publication number 20120211904
- Publication date Aug 23, 2012
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Mold Underfill Using Dis...
- Publication number 20120061858
- Publication date Mar 15, 2012
- STATS ChipPAC, Ltd.
- SooMoon Park
- H01 - BASIC ELECTRIC ELEMENTS