Byoungwook JANG

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Hwaseong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,710,673
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,252,031
- Issue date Feb 2, 2016
- Samsung Electronics Co., Ltd.
- Hohyeuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,252,095
- Issue date Feb 2, 2016
- Samsung Electronics Co., Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189835
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160111347
- Publication date Apr 21, 2016
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150084170
- Publication date Mar 26, 2015
- Hohyeuk IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20140008795
- Publication date Jan 9, 2014
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS