Byron Joseph Palla

Person

Sachse, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reduced semiconductor wafer bow and warpage
- Patent number 11,942,359
- Issue date Mar 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stripping one or more layers from a semiconductor wafer
- Patent number 11,205,575
- Issue date Dec 21, 2021
- Texas Instruments Incorporated
- Byron Joseph Palla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing optimization by combining small lots in...
- Patent number 8,707,220
- Issue date Apr 22, 2014
- Texas Instruments Incorporated
- Byron Joseph Palla
- G05 - CONTROLLING REGULATING
Information Patent Grant
Laser scribe on front side of semiconductor wafer
- Patent number 7,344,900
- Issue date Mar 18, 2008
- Texas Instruments Incorporated
- Byron Joseph Palla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE
- Publication number 20240194519
- Publication date Jun 13, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHALLOW TRENCH ISOLATION STRUCTURE WITH NITRIDE PULLBACK BY IMPLANT...
- Publication number 20240006230
- Publication date Jan 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahalingam NANDAKUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE
- Publication number 20230170248
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Abbas Ali
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STRIPPING ONE OR MORE LAYERS FROM A SEMICONDUCTOR WAFER
- Publication number 20200343099
- Publication date Oct 29, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Byron Joseph Palla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING OPTIMIZATION BY COMBINING SMALL LOTS IN...
- Publication number 20130344624
- Publication date Dec 26, 2013
- Byron Joseph PALLA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SCRIBE ON FRONT SIDE OF A SEMICONDUCTOR WAFER
- Publication number 20080090377
- Publication date Apr 17, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Byron Joseph Palla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser scribe on front side of semiconductor wafer
- Publication number 20040211750
- Publication date Oct 28, 2004
- Byron Joseph Palla
- H01 - BASIC ELECTRIC ELEMENTS

Byron Joseph Palla

Person

Patents Grantslast 30 patents

Reduced semiconductor wafer bow and warpage

Method for stripping one or more layers from a semiconductor wafer

Semiconductor manufacturing optimization by combining small lots in...

Laser scribe on front side of semiconductor wafer

Patents Applicationslast 30 patents

REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE

SHALLOW TRENCH ISOLATION STRUCTURE WITH NITRIDE PULLBACK BY IMPLANT...

REDUCED SEMICONDUCTOR WAFER BOW AND WARPAGE

METHOD FOR STRIPPING ONE OR MORE LAYERS FROM A SEMICONDUCTOR WAFER

SEMICONDUCTOR MANUFACTURING OPTIMIZATION BY COMBINING SMALL LOTS IN...

LASER SCRIBE ON FRONT SIDE OF A SEMICONDUCTOR WAFER

Laser scribe on front side of semiconductor wafer