Byron Williams

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Standalone high voltage galvanic isolation capacitors
- Patent number 12,230,669
- Issue date Feb 18, 2025
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including capacitor having segmented bottom plate
- Patent number 11,961,879
- Issue date Apr 16, 2024
- Texas Instruments Incorporated
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standalone isolation capacitor
- Patent number 11,901,402
- Issue date Feb 13, 2024
- Texas Instruments Incorporated
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device isolator with reduced parasitic capacitance
- Patent number 11,869,933
- Issue date Jan 9, 2024
- Texas Instruments Incorporated
- Raja Selvaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages with high angle wire bonding and non-...
- Patent number 11,848,297
- Issue date Dec 19, 2023
- Texas Instruments Incorporated
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Standalone high voltage galvanic isolation capacitors
- Patent number 11,784,212
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC including capacitor having segmented bottom plate
- Patent number 11,688,760
- Issue date Jun 27, 2023
- Texas Instruments Incorporated
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive components with improved characteristics
- Patent number 11,532,693
- Issue date Dec 20, 2022
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 11,495,553
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit packaging
- Patent number 11,227,852
- Issue date Jan 18, 2022
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a thick oxide feature on a semiconductor wafer
- Patent number 11,205,695
- Issue date Dec 21, 2021
- Texas Instruments Incorporated
- Elizabeth C. Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device isolator with reduced parasitic capacitance
- Patent number 11,107,883
- Issue date Aug 31, 2021
- Texas Instruments Incorporated
- Raja Selvaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scribe seals and methods of making
- Patent number 11,069,627
- Issue date Jul 20, 2021
- Texas Instruments Incorporated
- Thomas D. Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with underfill between a sensor coil and a se...
- Patent number 11,024,576
- Issue date Jun 1, 2021
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for high voltage integrated circuit capacitors
- Patent number 10,847,605
- Issue date Nov 24, 2020
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for patterning thick layers
- Patent number 10,811,492
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage galvanic isolation device
- Patent number 10,707,297
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for improving high voltage breakdown reliabili...
- Patent number 10,679,935
- Issue date Jun 9, 2020
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging
- Patent number 10,629,562
- Issue date Apr 21, 2020
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Opening in a multilayer polymeric dielectric layer without delamina...
- Patent number 10,546,821
- Issue date Jan 28, 2020
- Texas Instruments Incorporated
- Licheng Marshal Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for improving high voltage breakdown reliabili...
- Patent number 10,418,320
- Issue date Sep 17, 2019
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 10,366,958
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit with micro inductor and micro transformer with m...
- Patent number 10,349,526
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Byron Lovell Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with micro inductor and micro transformer with m...
- Patent number 10,251,280
- Issue date Apr 2, 2019
- Texas Instruments Incorporated
- Byron Lovell Williams
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Device isolator with reduced parasitic capacitance
- Patent number 10,186,576
- Issue date Jan 22, 2019
- Texas Instruments Incorporated
- Raja Selvaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage galvanic isolation device
- Patent number 10,147,784
- Issue date Dec 4, 2018
- Texas Instruments Incorporated
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for improving high voltage breakdown reliabili...
- Patent number 10,109,574
- Issue date Oct 23, 2018
- Texas Instruments Incorporated
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage polymer dielectric capacitor isolation device
- Patent number 9,893,008
- Issue date Feb 13, 2018
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heated capacitor and method of forming the heated capacitor
- Patent number 9,875,846
- Issue date Jan 23, 2018
- Texas Instruments Incorporated
- Honglin Guo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20240274570
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC INCLUDING CAPACITOR HAVING SEGMENTED BOTTOM PLATE
- Publication number 20240204040
- Publication date Jun 20, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDALONE ISOLATION CAPACITOR
- Publication number 20240120367
- Publication date Apr 11, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD SUPPRESSION FEATURE FOR GALVANIC ISOLATION DEVICE
- Publication number 20240112852
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDS FOR GALVANIC ISOLATION DEVICE
- Publication number 20240113155
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH...
- Publication number 20240112953
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE
- Publication number 20240113095
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yoshihiro Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORS
- Publication number 20230420489
- Publication date Dec 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DIE COMPRISING GALVANIC ISOLATION CAPACITOR
- Publication number 20230369198
- Publication date Nov 16, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Elizabeth Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC INCLUDING CAPACITOR HAVING SEGMENTED BOTTOM PLATE
- Publication number 20230268377
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDALONE ISOLATION CAPACITOR
- Publication number 20230154974
- Publication date May 18, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Elizabeth Costner Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ISOLATION CAPACITOR WITH ENHANCED BOTTOM PLATE
- Publication number 20230056046
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Byron Lovell Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC INCLUDING CAPACITOR HAVING SEGMENTED BOTTOM PLATE
- Publication number 20230058511
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...
- Publication number 20230005874
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Bo-Hsun Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20220352111
- Publication date Nov 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENTS WITH IMPROVED CHARACTERISTICS
- Publication number 20220231115
- Publication date Jul 21, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORS
- Publication number 20220069066
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer Bonifield
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC DEVICE WITH LAMINATE EMBEDDED MAGNETIC CORE
- Publication number 20210375540
- Publication date Dec 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Yuki Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE ISOLATOR WITH REDUCED PARASITIC CAPACITANCE
- Publication number 20210367030
- Publication date Nov 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Raja Selvaraj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE DEVICES WITH MULTIPLE POLYIMIDE LAYERS
- Publication number 20200381342
- Publication date Dec 3, 2020
- TEXAS INSTRUMENTS INCORPORATED
- YongSeok PARK
- G01 - MEASURING TESTING
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20200251440
- Publication date Aug 6, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE INCLUDING STANDALONE CAPACITORS
- Publication number 20200168534
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Thomas Dyer BONIFIELD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE FOR PATTERNING THICK LAYERS
- Publication number 20200135841
- Publication date Apr 30, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES
- Publication number 20200027848
- Publication date Jan 23, 2020
- TEXAS INSTRUMENTS INCORPORATED
- THOMAS DYER BONIFIELD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRUCTURE AND METHOD FOR IMPROVING HIGH VOLTAGE BREAKDOWN RELIABILI...
- Publication number 20200013713
- Publication date Jan 9, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey A. West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING
- Publication number 20190206828
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Honglin GUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES
- Publication number 20190206812
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- THOMAS DYER BONIFIELD
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF FABRICATING A THICK OXIDE FEATURE ON A SEMICONDUCTOR WAFER
- Publication number 20190198604
- Publication date Jun 27, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Elizabeth C. Stewart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH MICRO INDUCTOR AND MICRO TRANSFORMER WITH M...
- Publication number 20190182961
- Publication date Jun 13, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Byron Lovell Williams
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Byron Williams

Person

Patents Grantslast 30 patents

Standalone high voltage galvanic isolation capacitors

Stud bump for wirebonding high voltage isolation barrier connection

IC including capacitor having segmented bottom plate

Standalone isolation capacitor

Device isolator with reduced parasitic capacitance

Semiconductor device packages with high angle wire bonding and non-...

Standalone high voltage galvanic isolation capacitors

IC including capacitor having segmented bottom plate

Passive components with improved characteristics

Wire bonding between isolation capacitors for multichip modules

Integrated circuit packaging

Method of fabricating a thick oxide feature on a semiconductor wafer

Device isolator with reduced parasitic capacitance

Scribe seals and methods of making

Semiconductor package with underfill between a sensor coil and a se...

Methods and apparatus for high voltage integrated circuit capacitors

Method and device for patterning thick layers

High voltage galvanic isolation device

Structure and method for improving high voltage breakdown reliabili...

Integrated circuit packaging

Opening in a multilayer polymeric dielectric layer without delamina...

Structure and method for improving high voltage breakdown reliabili...

Wire bonding between isolation capacitors for multichip modules

Integrated circuit with micro inductor and micro transformer with m...

Integrated circuit with micro inductor and micro transformer with m...

Device isolator with reduced parasitic capacitance

High voltage galvanic isolation device

Structure and method for improving high voltage breakdown reliabili...

High voltage polymer dielectric capacitor isolation device

Heated capacitor and method of forming the heated capacitor

Patents Applicationslast 30 patents

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

IC INCLUDING CAPACITOR HAVING SEGMENTED BOTTOM PLATE

STANDALONE ISOLATION CAPACITOR

FIELD SUPPRESSION FEATURE FOR GALVANIC ISOLATION DEVICE

WIRE BONDS FOR GALVANIC ISOLATION DEVICE

METAL FILL STRUCTURES FOR ISOLATORS TO MEET METAL DENSITY AND HIGH...

STABILIZING DIELECTRIC STRESS IN A GALVANIC ISOLATION DEVICE

GALVANIC ISOLATION DEVICE

STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORS

INTEGRATED CIRCUIT (IC) DIE COMPRISING GALVANIC ISOLATION CAPACITOR

IC INCLUDING CAPACITOR HAVING SEGMENTED BOTTOM PLATE

STANDALONE ISOLATION CAPACITOR

INTEGRATED ISOLATION CAPACITOR WITH ENHANCED BOTTOM PLATE

IC INCLUDING CAPACITOR HAVING SEGMENTED BOTTOM PLATE

SEMICONDUCTOR DEVICE PACKAGES WITH HIGH ANGLE WIRE BONDING AND NON-...

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

PASSIVE COMPONENTS WITH IMPROVED CHARACTERISTICS

STANDALONE HIGH VOLTAGE GALVANIC ISOLATION CAPACITORS

INTEGRATED MAGNETIC DEVICE WITH LAMINATE EMBEDDED MAGNETIC CORE

DEVICE ISOLATOR WITH REDUCED PARASITIC CAPACITANCE

HIGH VOLTAGE DEVICES WITH MULTIPLE POLYIMIDE LAYERS

INTEGRATED CIRCUIT PACKAGING

MULTI-CHIP MODULE INCLUDING STANDALONE CAPACITORS

METHOD AND DEVICE FOR PATTERNING THICK LAYERS

WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES

STRUCTURE AND METHOD FOR IMPROVING HIGH VOLTAGE BREAKDOWN RELIABILI...

INTEGRATED CIRCUIT PACKAGING

WIRE BONDING BETWEEN ISOLATION CAPACITORS FOR MULTICHIP MODULES

METHOD OF FABRICATING A THICK OXIDE FEATURE ON A SEMICONDUCTOR WAFER

INTEGRATED CIRCUIT WITH MICRO INDUCTOR AND MICRO TRANSFORMER WITH M...