Byung Chun LEE

Follow

Person

Beijing, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Via-hole etching method
- Patent number 9,564,354
- Issue date Feb 7, 2017
- BOE Technology Group Co., Ltd.
- Byung Chun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing array substrate by forming common electrod...
- Patent number 9,240,353
- Issue date Jan 19, 2016
- BOE Technology Group Co., Ltd.
- Yuqing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor with reduced edge slope angle, array substrate...
- Patent number 8,633,066
- Issue date Jan 21, 2014
- BOE Technology Group Co., Ltd.
- Byung Chun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CURING APPARATUS AND CURING METHOD
- Publication number 20170087587
- Publication date Mar 30, 2017
- BOE TECHNOLOGY GROUP CO., LTD.
- Li XIONG
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
METHOD FOR PREPARING FILM PATTERNS
- Publication number 20160260614
- Publication date Sep 8, 2016
- BOE TECHNOLOGY GROUP CO., LTD.
- Yuqing YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA-HOLE ETCHING METHOD
- Publication number 20150303099
- Publication date Oct 22, 2015
- BOE TECHNOLOGY GROUP CO., LTD.
- Byung Chun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ARRAY SUBSTRATE
- Publication number 20150214120
- Publication date Jul 30, 2015
- BOE TECHNOLOGY GROUP CO., LTD.
- Yuqing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR, ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20120086013
- Publication date Apr 12, 2012
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Byung Chun LEE
- H01 - BASIC ELECTRIC ELEMENTS