Byung Hoon Moon

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Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Hybrid mold chase surface for semiconductor bonding and related sys...
- Patent number 12,191,164
- Issue date Jan 7, 2025
- Micron Technology, Inc.
- Byung Hoon Moon
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
PIEZOELECTRIC MATERIALS FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BO...
- Publication number 20240071986
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MOLD CHASE SURFACE FOR SEMICONDUCTOR BONDING AND RELATED SYS...
- Publication number 20230268198
- Publication date Aug 24, 2023
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC BONDING LAYERS FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASSOCIA...
- Publication number 20230050652
- Publication date Feb 16, 2023
- Micron Technology, Inc.
- Byung Hoon Moon
- H01 - BASIC ELECTRIC ELEMENTS