Byung J. Han

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Scotch Plains, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Thin packaging of multi-chip modules with enhanced thermal/power ma...
- Patent number 5,646,828
- Issue date Jul 8, 1997
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging multi-chip modules without wire-bond interconnection
- Patent number 5,608,262
- Issue date Mar 4, 1997
- Lucent Technologies Inc.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package having electronic device boonded, at a lo...
- Patent number 5,473,512
- Issue date Dec 5, 1995
- AT&T Corp.
- Yinon Degani
- H01 - BASIC ELECTRIC ELEMENTS