Byung Keun Hwang

Person

  • Midland, MI, US

Patents Grantslast 30 patents

  • Information Patent Grant

    1,1,1-tris(organoamino)disilane compounds and method of preparing same

    • Patent number 11,691,993
    • Issue date Jul 4, 2023
    • JIANGSU NATA OPTO-ELECTRONIC MATERIALS CO. LTD.
    • Byung K. Hwang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Thio(di)silanes

    • Patent number 11,598,002
    • Issue date Mar 7, 2023
    • DDP Specialty Electronic Materials US 9, LLC
    • Noel Mower Chang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Thio(di)silanes

    • Patent number 11,479,858
    • Issue date Oct 25, 2022
    • Dow Silicones Corporation
    • Noel Mower Chang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Trichlorodisilane

    • Patent number 11,142,462
    • Issue date Oct 12, 2021
    • Jiangsu Nata Opto-Electronic Materials Co. Ltd.
    • Byung K Hwang
    • C01 - INORGANIC CHEMISTRY
  • Information Patent Grant

    Tris(disilanyl)amine

    • Patent number 11,040,989
    • Issue date Jun 22, 2021
    • Jiangsu Nata Opto-Electronic Materials Co., Ltd.
    • Brian D. Rekken
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Aged polymeric silsesquioxanes

    • Patent number 10,597,495
    • Issue date Mar 24, 2020
    • Dow Silicones Corporation
    • Peng-Fei Fu
    • C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
  • Information Patent Grant

    Method for fabricating semiconductor device including forming a die...

    • Patent number 10,049,882
    • Issue date Aug 14, 2018
    • Samsung Electronics Co., Ltd.
    • Won Woong Chung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for producing hydrogenated silicon-oxycarbide films

    • Patent number 7,189,664
    • Issue date Mar 13, 2007
    • Dow Corning Corporation
    • Mark Jon Loboda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Deposition method of insulating layers having low dielectric consta...

    • Patent number 6,984,594
    • Issue date Jan 10, 2006
    • Samsung Electronics, Co., LTD
    • Sung-Hoon Yang
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    H:SiOC coated substrates

    • Patent number 6,667,553
    • Issue date Dec 23, 2003
    • Dow Corning Corporation
    • Glenn Allen Cerny
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method for producing hydrogenated silicon oxycarbide films having l...

    • Patent number 6,593,248
    • Issue date Jul 15, 2003
    • Dow Corning Corporation
    • Mark Jon Loboda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method of forming a silicon nitride layer in a semiconductor device

    • Patent number 6,372,672
    • Issue date Apr 16, 2002
    • Samsung Electronics Co., Ltd.
    • Do-Hyung Kim
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents