Byung Kil SEO

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer capacitor
- Patent number 11,776,746
- Issue date Oct 3, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 11,728,093
- Issue date Aug 15, 2023
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor
- Patent number 11,515,091
- Issue date Nov 29, 2022
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Jeong In Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor
- Patent number 9,502,180
- Issue date Nov 22, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kang Sun An
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic capacitor having a floating electrode
- Patent number 9,318,263
- Issue date Apr 19, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Byung Kil Seo
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multilayer ceramic electronic component and manufacturing method th...
- Patent number 9,305,686
- Issue date Apr 5, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Byung Sung Kang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Multilayer ceramic electronic component
- Patent number 8,780,523
- Issue date Jul 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Byung Kil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered ceramic electronic component
- Patent number 8,570,711
- Issue date Oct 29, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Byung Kil Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board manufacturing system and manufacturing method...
- Patent number 8,535,547
- Issue date Sep 17, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Chung-Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board using paste bump and manufacturing method the...
- Patent number 7,973,248
- Issue date Jul 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board using paste bumps
- Patent number 7,859,106
- Issue date Dec 28, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating core substrate using paste bumps
- Patent number 7,622,329
- Issue date Nov 24, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20220351904
- Publication date Nov 3, 2022
- Samsung Electro-Mechanics Co., Ltd.
- Jeong In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CAPACITOR
- Publication number 20210082621
- Publication date Mar 18, 2021
- Samsung Electro-Mechanics Co., Ltd.
- Jeong In KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20150179339
- Publication date Jun 25, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Byung Kil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR
- Publication number 20150170842
- Publication date Jun 18, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Kang Sun AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140293500
- Publication date Oct 2, 2014
- Samsung Electro-Mechanics CO., LTD.
- Byung Kil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT
- Publication number 20130100576
- Publication date Apr 25, 2013
- Samsung Electro-Mechanics CO., LTD.
- Byung Kil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...
- Publication number 20130082575
- Publication date Apr 4, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Byung Sung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYERED CERAMIC ELECTRONIC COMPONENT
- Publication number 20130050898
- Publication date Feb 28, 2013
- Samsung Electro-Mechanics CO., LTD.
- Byung Kil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT
- Publication number 20130027843
- Publication date Jan 31, 2013
- Samsung Electro-Mechanics CO., LTD.
- Byung Kil SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120168220
- Publication date Jul 5, 2012
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Han Ul Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board manufacturing system
- Publication number 20110138616
- Publication date Jun 16, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Chung-Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core substrate and multilayer printed circuit board using paste bumps
- Publication number 20100025092
- Publication date Feb 4, 2010
- Samsung Electro Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20090064497
- Publication date Mar 12, 2009
- Samsung Electro-Mechanics Co.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board manufacturing system and manufacturing method...
- Publication number 20090026169
- Publication date Jan 29, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Chung-Woo Cho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20080283288
- Publication date Nov 20, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Core substrate and multilayer printed circuit board using paste bum...
- Publication number 20070120253
- Publication date May 31, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Yoong Oh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board using paste bump and manufacturing method the...
- Publication number 20070107934
- Publication date May 17, 2007
- Samsung Electro-Mechanics Co., Ltd.
- Jee-Soo Mok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Byung Kil SEO

Person

Patents Grantslast 30 patents

Multilayer capacitor

Multilayer capacitor

Multilayer capacitor

Multilayer ceramic capacitor

Multilayer ceramic capacitor having a floating electrode

Multilayer ceramic electronic component and manufacturing method th...

Multilayer ceramic electronic component

Multilayered ceramic electronic component

Printed circuit board manufacturing system and manufacturing method...

Printed circuit board using paste bump and manufacturing method the...

Multilayer printed circuit board using paste bumps

Method for fabricating core substrate using paste bumps

Patents Applicationslast 30 patents

MULTILAYER CAPACITOR

MULTILAYER CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR

MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

MULTILAYER CERAMIC ELECTRONIC COMPONENT

MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD TH...

MULTILAYERED CERAMIC ELECTRONIC COMPONENT

MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT

MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Printed circuit board manufacturing system

Core substrate and multilayer printed circuit board using paste bumps

Printed circuit board using paste bump and manufacturing method the...

Printed circuit board manufacturing system and manufacturing method...

Printed circuit board using paste bump and manufacturing method the...

Core substrate and multilayer printed circuit board using paste bum...

Printed circuit board using paste bump and manufacturing method the...