Byung-Moon Bae

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Daegu, KR

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Patents Grantslast 30 patents

Information Patent Grant
Methods of manufacturing semiconductor chip
- Patent number 11,967,529
- Issue date Apr 23, 2024
- Samsung Electronics Co., Ltd.
- Byung-moon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of dicing a semiconductor substrate having a scribe lane def...
- Patent number 11,710,706
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Hyun-Su Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor chip and method of dicing a sem...
- Patent number 11,107,773
- Issue date Aug 31, 2021
- Samsung Electronics Co., Ltd.
- Hyun-Su Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor chip
- Patent number 10,854,517
- Issue date Dec 1, 2020
- Samsung Electronics Co., Ltd.
- Byung-moon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip that includes a cover protection layer covering...
- Patent number 10,651,105
- Issue date May 12, 2020
- Samsung Electronics Co., Ltd.
- Yun-Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND METHOD OF DICING A SEM...
- Publication number 20210366837
- Publication date Nov 25, 2021
- Samsung Electronics Co., Ltd.
- HYUN-SU SIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20210057278
- Publication date Feb 25, 2021
- Samsung Electronics Co., Ltd.
- Byung-moon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND METHOD OF DICING A SEM...
- Publication number 20200168556
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- HYUN-SU SIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR CHIP
- Publication number 20200058551
- Publication date Feb 20, 2020
- Samsung Electronics Co., Ltd.
- Byung-moon Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP THAT INCLUDES A COVER PROTECTION LAYER COVERING...
- Publication number 20200020604
- Publication date Jan 16, 2020
- Samsung Electronics, Co., Ltd.
- Yun-Hee Kim
- H01 - BASIC ELECTRIC ELEMENTS