Byungkyu JANG

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging substrate and method for manufacturing same
- Patent number 12,198,994
- Issue date Jan 14, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,165,979
- Issue date Dec 10, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loading cassette for substrate including glass and substrate loadin...
- Patent number 11,981,501
- Issue date May 14, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate, and semiconductor device comprising same
- Patent number 11,967,542
- Issue date Apr 23, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate with core layer and cavity structure and semico...
- Patent number 11,652,039
- Issue date May 16, 2023
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
- Publication number 20240128177
- Publication date Apr 18, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20230207442
- Publication date Jun 29, 2023
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
- Publication number 20220165650
- Publication date May 26, 2022
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20220148942
- Publication date May 12, 2022
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220059421
- Publication date Feb 24, 2022
- SKC CO., LTD.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20220051972
- Publication date Feb 17, 2022
- SKC CO., LTD.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOADING CASSETTE FOR SUBSTRATE INCLUDING GLASS AND SUBSTRATE LOADIN...
- Publication number 20220048699
- Publication date Feb 17, 2022
- SKC CO., LTD.
- Sungjin KIM
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
- Publication number 20210384131
- Publication date Dec 9, 2021
- SKC CO., LTD.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS

Byungkyu JANG

Person

Patents Grantslast 30 patents

Packaging substrate and method for manufacturing same

Packaging substrate and semiconductor apparatus comprising same

Loading cassette for substrate including glass and substrate loadin...

Packaging substrate, and semiconductor device comprising same

Packaging substrate with core layer and cavity structure and semico...

Patents Applicationslast 30 patents

PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME

PACKAGING SUBSTRATE, AND SEMICONDUCTOR DEVICE COMPRISING SAME

PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

LOADING CASSETTE FOR SUBSTRATE INCLUDING GLASS AND SUBSTRATE LOADIN...

PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME