Byungmin YU

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Sejong-si, KR

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Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240234268
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- SEUNGWAN SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240136261
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- SEUNGWAN SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230326871
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230146085
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- Junghoon KANG
- H01 - BASIC ELECTRIC ELEMENTS