Byungmoon BAE

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Daegu, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 12,062,626
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,854,892
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method of sawing the same
- Patent number 11,676,914
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate dicing method, method of fabricating semiconductor device...
- Patent number 11,322,405
- Issue date May 3, 2022
- Samsung Electronics Co., Ltd.
- Junho Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates
- Patent number 10,256,181
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates
- Patent number 10,032,706
- Issue date Jul 24, 2018
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME
- Publication number 20230275037
- Publication date Aug 31, 2023
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20220208610
- Publication date Jun 30, 2022
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF SAWING THE SAME
- Publication number 20220059472
- Publication date Feb 24, 2022
- Samsung Electronics Co., Ltd.
- Hwayoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DICING METHOD, METHOD OF FABRICATING SEMICONDUCTOR DEVICE...
- Publication number 20210159121
- Publication date May 27, 2021
- Samsung Electronics Co., Ltd.
- Junho YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20180315698
- Publication date Nov 1, 2018
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20170077041
- Publication date Mar 16, 2017
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS