C. C. CHANG

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a passivation layer and method of making
- Patent number 12,002,771
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect
- Patent number 11,817,404
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect
- Patent number 11,114,395
- Issue date Sep 7, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a passivation layer
- Patent number 11,018,100
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post passivation interconnect and fabrication method therefor
- Patent number 10,453,811
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-An Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a passivation layer and method of makin...
- Patent number 10,290,596
- Issue date May 14, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Lung Shih
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER
- Publication number 20240321787
- Publication date Sep 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION INTERCONNECT
- Publication number 20240079357
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION INTERCONNECT
- Publication number 20210375802
- Publication date Dec 2, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKING
- Publication number 20210265292
- Publication date Aug 26, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION INTERCONNECT
- Publication number 20200051934
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER
- Publication number 20190273056
- Publication date Sep 5, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKIN...
- Publication number 20180166406
- Publication date Jun 14, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Lung SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST PASSIVATION INTERCONNECT AND FABRICATION METHOD THEREFOR
- Publication number 20180151520
- Publication date May 31, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-An LIN
- H01 - BASIC ELECTRIC ELEMENTS

C. C. CHANG

Person

Patents Grantslast 30 patents

Semiconductor device having a passivation layer and method of making

Post passivation interconnect

Post passivation interconnect

Semiconductor device having a passivation layer

Post passivation interconnect and fabrication method therefor

Semiconductor device having a passivation layer and method of makin...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

POST PASSIVATION INTERCONNECT

POST PASSIVATION INTERCONNECT

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKING

POST PASSIVATION INTERCONNECT

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKIN...

POST PASSIVATION INTERCONNECT AND FABRICATION METHOD THEREFOR