C. S. Cheng

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Hsinchu Hsien, TW

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Patents Grantslast 30 patents

Information Patent Grant
Memory module structure
- Patent number 6,642,554
- Issue date Nov 4, 2003
- Kingpak Technology, Inc.
- Nai Hua Yeh
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Jig structure for an integrated circuit package
- Publication number 20030118680
- Publication date Jun 26, 2003
- Chief Lin
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Structure of stacked integrated circuits and method for manufacturi...
- Publication number 20020096762
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of image sensors and method for packaging the same
- Publication number 20020096763
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging structure of image sensor and method for packaging the same
- Publication number 20020096758
- Publication date Jul 25, 2002
- Mon Nan Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package structure of an integrated circuit
- Publication number 20020096747
- Publication date Jul 25, 2002
- Nai Hua Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE OF STACKED INTEGRATED CIRCUITS AND METHOD FOR MANUFACTURI...
- Publication number 20020096761
- Publication date Jul 25, 2002
- Wen Chuan Chen
- H01 - BASIC ELECTRIC ELEMENTS