Cai-Ling Wu

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method for forming a semiconductor structure by diffusing manganese...
- Patent number 12,341,101
- Issue date Jun 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with reduced capacitances
- Patent number 12,046,506
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,901,228
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,830,770
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-wire cavity for low capacitance
- Patent number 11,551,968
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned scheme for semiconductor device and method of forming...
- Patent number 11,342,222
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240379436
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES WITH REDUCED CAPACITANCES
- Publication number 20240021468
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230411210
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...
- Publication number 20230377966
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FO...
- Publication number 20230369226
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Forming Interconnect Structures in Semiconductor Devices
- Publication number 20230060269
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Interconnect Structure And Method Of Forming The Same
- Publication number 20230011792
- Publication date Jan 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-WIRE CAVITY FOR LOW CAPACITANCE
- Publication number 20220359266
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Reduced Capacitances
- Publication number 20220359263
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsin Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20220319922
- Publication date Oct 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cai-Ling Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20220277991
- Publication date Sep 1, 2022
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTER-WIRE CAVITY FOR LOW CAPACITANCE
- Publication number 20210335655
- Publication date Oct 28, 2021
- Taiwan Semiconductor Manufacturing Co., LTD
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Scheme for Semiconductor Device and Method of Forming...
- Publication number 20210098290
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsiu-Wen Hsueh
- H01 - BASIC ELECTRIC ELEMENTS

Cai-Ling Wu

Person

Patents Grantslast 30 patents

Method for forming a semiconductor structure by diffusing manganese...

Devices with reduced capacitances

Self-aligned scheme for semiconductor device and method of forming...

Self-aligned scheme for semiconductor device and method of forming...

Inter-wire cavity for low capacitance

Self-aligned scheme for semiconductor device and method of forming...

Patents Applicationslast 30 patents

SELF-ALIGNED INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME

DEVICES WITH REDUCED CAPACITANCES

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

SELF-ALIGNED SCHEME FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING...

SEMICONDUCTOR DEVICE STRUCTURE WITH BARRIER LAYER AND METHOD FOR FO...

Forming Interconnect Structures in Semiconductor Devices

Self-Aligned Interconnect Structure And Method Of Forming The Same

INTER-WIRE CAVITY FOR LOW CAPACITANCE

Devices with Reduced Capacitances

Self-Aligned Scheme for Semiconductor Device and Method of Forming...

Self-Aligned Scheme for Semiconductor Device and Method of Forming...

INTER-WIRE CAVITY FOR LOW CAPACITANCE

Self-Aligned Scheme for Semiconductor Device and Method of Forming...